Display device

ABSTRACT

A display device is provided. The display device includes a pixel-displaying region, including: at least two pixels including a plurality of sub-pixels; and a light-shielding layer including a matrix portion and an enlarged portion, wherein the enlarged portion is disposed at an intersection of two of the adjacent sub-pixels and is adjacent to the matrix portion; wherein the matrix portion defines the sub-pixels, and a total area of the sub-pixels is defined as a first area and a ratio of an area of the enlarged portion to the first area is about 1.5% to 6%.

CROSS REFERENCE TO RELATED APPLICATIONS

This application claims the benefit of priority from, and is acontinuation application of, U.S. patent application Ser. No. 14/656,461filed on Mar. 12, 2015, entitled “Display device”, which claims priorityof Taiwan Patent Application No. 103132928, filed on Sep. 24, 2014,which claims the benefit of priority from a provisional application ofU.S. Patent Application No. 61/952,929, filed on Mar. 14, 2014, and aprovisional application of U.S. Patent Application No. 61/989,046, filedon May 6, 2014; Taiwan Patent Application No. 103133162, filed on Sep.25, 2014, which claims the benefit of priority from a provisionalapplication of U.S. Patent Application No. 61/952,929, filed on Mar. 14,2014; Taiwan Patent Application No. 103137140, filed on Oct. 28, 2014,which claims the benefit of priority from a provisional application ofU.S. Patent Application No. 61/952,929, filed on Mar. 14, 2014, and aprovisional application of U.S. Patent Application No. 62/019,993, filedon Jul. 2, 2014; Taiwan Patent Application No. 103137142, filed on Oct.28, 2014, which claims the benefit of priority from a provisionalapplication of U.S. Patent Application No. 61/952,929, filed on Mar. 14,2014, a provisional application of U.S. Patent Application No.61/976,203, filed on Apr. 7, 2014, and a provisional application of U.S.Patent Application No. 62/019,993, filed on Jul. 2, 2014; Taiwan PatentApplication No. 103140591, filed on Nov. 24, 2014, which claims thebenefit of priority from a provisional application of U.S. PatentApplication No. 61/952,929 filed on Mar. 14, 2014, a provisionalapplication of U.S. Patent Application No. 62/019,993, filed on Jul. 2,2014; and a provisional application of U.S. Patent Application No.61/976,810, filed on Apr. 8, 2014, the entirety of which is incorporatedby reference herein.

BACKGROUND

Technical Field

The disclosure relates to a display device, and in particular to adisplay device having a light-shielding layer.

Description of the Related Art

Display devices are becoming more widely used in the display elements ofvarious products. Liquid-crystal molecules have different lightpolarization or light refraction effects at different alignmentconfigurations, and the liquid-crystal display devices utilize thischaracteristic to control light penetration to generate images.Conditional twisted nematic liquid-crystal display devices have goodlight penetration characteristics. However, when applied in ahigh-resolution display device, they cannot provide sufficient apertureratio and view angle due to pixel design and structure, and the opticalcharacteristics of the liquid-crystal molecules.

In order to solve this problem, various liquid-crystal display deviceswith wide-angle and high aperture ratio are developed, such as anin-plane switching liquid-crystal display device or a fringe-fieldswitching liquid-crystal display device. However, those liquid-crystaldisplay devices may have light leakage problems or mura issues, whichcan deteriorate the quality of the display.

Therefore, a display device which may further reduce light leakageproblems and mura issues is needed.

SUMMARY

The present disclosure provides a display device, including: apixel-displaying region, including: at least two pixels including aplurality of sub-pixels; and a light-shielding layer including a matrixportion and an enlarged portion, wherein the enlarged portion isdisposed at an intersection of two of the adjacent sub-pixels and isadjacent to the matrix portion; wherein the matrix portion defines thesub-pixels, and a total area of the sub-pixels is defined as a firstarea and a ratio of an area of the enlarged portion to the first area isabout 1.5% to 6%.

A detailed description is given in the following embodiments withreference to the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

The disclosure may be more fully understood by reading the subsequentdetailed description and examples with references made to theaccompanying drawings, wherein:

FIG. 1A is a top view of a display device in accordance with someembodiments of the present disclosure;

FIG. 1B is an enlarged figure of a portion of the display device in FIG.1A;

FIG. 1C is a top view of the display device in FIG. 1B without theenlarged portion;

FIG. 2A is a cross-sectional view of a display device in accordance withsome embodiments of the present disclosure;

FIG. 2B is a top view of a display device in accordance with someembodiments of the present disclosure;

FIG. 2C is a side view of a display device in accordance with someembodiments of the present disclosure;

FIG. 3A is a top view of a display device in accordance with anotherembodiment of the present disclosure;

FIG. 3B is a side view of a display device in accordance with anotherembodiment of the present disclosure;

FIG. 4 is a top view of a display device in accordance with anotherembodiment of the present disclosure;

FIG. 5 is a top view of a display device in accordance with anotherembodiment of the present disclosure;

FIG. 6 is a top view of a display device in accordance with anotherembodiment of the present disclosure;

FIG. 7 is a cross-sectional view of a display device in accordance withanother embodiment of the present disclosure;

FIG. 8A is a top view of a display device in accordance with someembodiments of the present disclosure;

FIG. 8B is an enlarged figure of a portion of the display device in FIG.8A;

FIG. 9 is a top view of a test pad in accordance with some embodimentsof the present disclosure;

FIGS. 10A-10B are cross-sectional views of the test pad along line 3-3in FIG. 9;

FIG. 11 is a top view of a test pad in accordance with anotherembodiment of the present disclosure;

FIG. 12 is a top view of a test pad in accordance with anotherembodiment of the present disclosure;

FIG. 13 is a top view of a test pad in accordance with anotherembodiment of the present disclosure; and

FIG. 14 is a top view of a test pad in accordance with anotherembodiment of the present disclosure;

FIG. 15 is a top view of a display device according to an embodiment ofthe disclosure;

FIG. 16A is a cross-sectional view of the display device shown in FIG.15 along line A-A′;

FIGS. 16B and 16C are cross-sectional views of the display devicesaccording to some embodiments of the disclosure along line A-A′ of FIG.15;

FIG. 17 is a top view of a display device according to anotherembodiment of the disclosure;

FIG. 18A is a cross-sectional view of the display device shown in FIG.17 along line B-B′;

FIGS. 18B and 18C are cross-sectional views of the display devicesaccording to some embodiments of the disclosure along line B-B′ of FIG.17;

FIG. 19 is a top view of a display device according to still anotherembodiment of the disclosure;

FIG. 20 is a cross-sectional view of the display device shown in FIG. 19along line C-C′;

FIGS. 21 and 22 are top views of display device main substratesaccording to embodiments of the disclosure;

FIG. 23A is a top view of a display device in accordance with someembodiments of the present disclosure;

FIG. 23B is a cross-sectional view along line 1B-1B in FIG. 23A inaccordance with some embodiments of the present disclosure;

FIG. 24 is a top view of a display device in accordance with anotherembodiment of the present disclosure;

FIG. 25 is a cross-sectional view of a display device in accordance withanother embodiment of the present disclosure;

FIG. 26 is a cross-sectional view of a display device in accordance withanother embodiment of the present disclosure;

FIG. 27 is a cross-sectional view of a display device in accordance withanother embodiment of the present disclosure;

FIG. 28 is a top-view of a display device according to an embodiment ofthe disclosure;

FIG. 29 is a schematic drawing of the display device of FIG. 28 in the Xdirection;

FIGS. 30A to 30D are cross-sectional views of the display devices ofFIG. 28 along line E-E′;

FIG. 31 is a cross-sectional view of the display device according toanother embodiment of the disclosure along line E-E′ of FIG. 28;

FIG. 32 is a top-view of a display device main substrate according to anembodiment of the disclosure, wherein the display device of FIG. 28 isobtained by cutting the display device main substrate of FIG. 32;

FIGS. 33A to 33F are close-up diagrams of the second stable region 160Bof the display device main substrate of FIG. 32;

FIG. 34 is a top-view of a display device according to anotherembodiment of the disclosure;

FIG. 35 is a top-view of a display device having a test circuitaccording to an embodiment of the disclosure; and

FIGS. 36 and 37 are top-views of display devices having a test circuitaccording to other embodiments of the disclosure.

DETAILED DESCRIPTION

The display device of the present disclosure is described in detail inthe following description. In the following detailed description, forpurposes of explanation, numerous specific details and embodiments areset forth in order to provide a thorough understanding of the presentdisclosure. The specific elements and configurations described in thefollowing detailed description are set forth in order to clearlydescribe the present disclosure. It will be apparent, however, that theexemplary embodiments set forth herein are used merely for the purposeof illustration, and the inventive concept may be embodied in variousforms without being limited to those exemplary embodiments. In addition,the drawings of different embodiments may use like and/or correspondingnumerals to denote like and/or corresponding elements in order toclearly describe the present disclosure. However, the use of like and/orcorresponding numerals in the drawings of different embodiments does notsuggest any correlation between different embodiments. In addition, inthis specification, expressions such as “first insulating bump disposedon/over a second material layer”, may indicate not only the directcontact of the first insulating bump and the second material layer, butalso, a non-contact state with one or more intermediate layers betweenthe first insulating bump and the second material layer. In the abovesituation, the first insulating bump may not directly contact the secondmaterial layer.

It should be noted that the elements or devices in the drawings of thepresent disclosure may be present in any form or configuration known tothose skilled in the art. In addition, the expression “a layer overlyinganother layer”, “a layer is disposed above another layer”, “a layer isdisposed on another layer” and “a layer is disposed over another layer”may indicate that the layer directly contacts the other layer, but itmay also indicate that the layer does not directly contact the otherlayer, there being one or more intermediate layers disposed between thelayer and the other layer.

In addition, in this specification, relative expressions are used. Forexample, “lower”, “bottom”, “higher” or “top” are used to describe theposition of one element relative to another. It should be appreciatedthat if a device is flipped upside down, an element that is “lower” willbecome an element that is “higher”.

The terms “about” and “substantially” typically mean +/−20% of thestated value, more typically +/−10% of the stated value, more typically+/−5% of the stated value, more typically +/−3% of the stated value,more typically +/−2% of the stated value, more typically +/−1% of thestated value and even more typically +/−0.5% of the stated value. Thestated value of the present disclosure is an approximate value. Whenthere is no specific description, the stated value includes the meaningof “about” or “substantially”.

It should be understood that, although the terms first, second, thirdetc. may be used herein to describe various elements, components,regions, layers and/or sections, these elements, components, regions,layers and/or sections should not be limited by these terms. These termsare only used to distinguish one element, component, region, layer orsection from another region, layer or section. Thus, a first element,component, region, layer or section discussed below could be termed asecond element, component, region, layer or section without departingfrom the teachings of the present invention.

Unless defined otherwise, all technical and scientific terms used hereinhave the same meaning as commonly understood to one of ordinary skill inthe art to which this invention belongs. It should be appreciated that,in each case, the term, which is defined in a commonly used dictionary,should be interpreted as having a meaning that conforms to the relativeskills and the background or the context of the present disclosure, andshould not be interpreted in an idealized or overly formal manner unlessso defined.

The term “substrate” is meant to include devices formed within asemiconductor wafer and the layers overlying the wafer. The term“substrate surface” is meant to include the uppermost exposed layers ona semiconductor wafer, such as silicon surface, and insulating layer andmetallurgy lines.

The present disclosure utilizes an enlarge portion of thelight-shielding layer to further shield the region of the display devicewhich may have light leakage problems to further improve the contrast ofthe display device. In addition, the enlarged portion may prevent themura issue and further improve the display quality.

FIG. 1A is a top view of a display device 100 in accordance with someembodiments of the present disclosure. As shown in FIG. 1A, the displaydevice 100 includes a pixel-displaying region 104 and a non-displayregion 105 adjacent to the pixel-displaying region 104. In thisembodiment, the non-display region 105 surrounds or encloses thepixel-displaying region 104. The pixel-displaying region 104 refers tothe region in the display device 100 in which the pixel includingtransistor is disposed and displays. The transistor may include, but isnot limited to, a thin film transistor. In addition, the non-displayregion 105 may include an out lead bonding (OLB) region 115, as shown inFIG. 1A.

The display device 100 may include, but is not limited to, aliquid-crystal display such as a thin film transistor liquid-crystaldisplay. Alternatively, the liquid-crystal display may include, but isnot limited to, a twisted nematic (TN) liquid-crystal display, a supertwisted nematic (STN) liquid-crystal display, a double layer supertwisted nematic (DSTN) liquid-crystal display, a vertical alignment (VA)liquid-crystal display, an in-plane switching (IPS) liquid-crystaldisplay, a cholesteric liquid-crystal display, a blue phaseliquid-crystal display, or any other suitable liquid-crystal display.

Next, referring to FIG. 1B, which is an enlarged figure of a portion 1Bof the display device 100 in FIG. 1A. As shown in FIG. 1B, thepixel-displaying region 104 includes at least two pixels 400 and alight-shielding layer 128. The pixel 400 includes a plurality ofsub-pixels 402. For example, in the embodiment shown in FIG. 1B, each ofthe pixels 400 includes three sub-pixels 402. The light-shielding layer128 may include, but is not limited to, black photoresist, blackprinting ink, black resin or any other suitable light-shieldingmaterials of various colors. In addition, the light-shielding layer 128includes a matrix portion 404 and an enlarged portion 406. This matrixportion 404 defines the sub-pixels 402. The enlarged portion 406 isdisposed at an intersection 408 of two of the adjacent sub-pixels 402and is adjacent to the matrix portion 404. The matrix portion 404 of thelight-shielding layer 128 is used to shield the non-display region 105and the elements in the pixel-displaying region 104 other than thepixels. The enlarged portion 406 is used to shield the region of thesub-pixels 402 which may have light leakage problems in the displaydevice 100.

As shown in FIG. 1B, the matrix portion 404 of the light-shielding layer128 includes a plurality of columns of matrix portion 404C and aplurality of rows of matrix portion 404R. The columns of matrix portion404C and rows of matrix portion 404R defines the plurality of sub-pixels402. The enlarged portion 406 of the light-shielding layer 128 isdisposed at an intersection 408 of the column of matrix portion 404C androw of matrix portion 404R. The enlarged portion 406 covers a portion ofthe sub-pixel 402. For example, as shown in FIG. 1B, the enlargedportion 406 covers a portion of the four sub-pixels 402 adjacent to theintersection 408. In other words, all of the four sub-pixels 402adjacent to the intersection 408 are partially covered by the enlargedportion 406. In one embodiment, the edge of the enlarged portion 406 hasa circular arc shape.

FIG. 1C is a top view of the display device 100 in FIG. 1B without theenlarged portion 406. In FIG. 1C, the total area of the six sub-pixels402 is defined as a first area. The ratio of the area of the enlargedportion 406 in FIG. 1B to this first area may range from about 1.5% to6%, preferably from about 2.5% to 5%. In particular, as shown in FIGS.1B and 1C, the enlarged portion 406 may include the four fan-shapedregions (or circular sector regions) of the light-shielding layer 128disposed around the intersection 408. The four fan-shaped regions (orcircular sector regions) are disposed completely in the sub-pixels 402and shield portions of the corresponding sub-pixels 402. In addition,the two adjacent pixels 400 in FIG. 1B include six sub-pixels 402. Fourof the sub-pixels 402 which are adjacent to the intersection 408 arepartially covered by the enlarged portion 406 (namely the fourfan-shaped regions or circular sector regions), and the other twosub-pixels 402 are not covered by the enlarged portion 406. The ratio ofthe area of the enlarged portion 406 (namely the four fan-shaped regionsor circular sector regions) disposed between the two adjacent pixels 400to the area of the six sub-pixels 402 of the two adjacent pixels 400when not being covered by the enlarged portion 406 (namely the area ofthe six sub-pixels 402 shown in FIG. 1C) may range from about 1.5% to6%, preferably from about 2.5% to 5%.

The enlarged portion 406 with the specific area ratio may shield theregion of the display device where the light leakage issue may occur tofurther improve the contrast of the display device. In addition, theenlarged portion 406 may prevent the mura issue and further improve thedisplay quality.

In particular, light leakage often occurs at the intersection 408(namely the intersection 408 of the column of matrix portion 404C androw of matrix portion 404R) of the two adjacent sub-pixels 402 in thedisplay device 100 due to the spacer disposed at the intersection 408.Therefore, the enlarged portion 406 disposed at the intersection 408 mayshield the alignment light leakage or the scrub light leakage due to thespacer to improve the contrast of the display device. However, if thearea of the enlarged portion 406 is too large, for example if the arearatio is larger than 6%, the display device 100 would have the muraissue. However, if the area ratio is too small, for example if the arearatio is smaller than 1.5%, the area of the enlarged portion 406 wouldbe too small to effectively shield against light leakage.

FIG. 2A is a cross-sectional view of a display device 100 in accordancewith some embodiments of the present disclosure. As shown in FIG. 2A,the display device 100 further include a first substrate 101, a secondsubstrate 103 disposed opposite to the first substrate 101 and a mainspacer 142 and a sub-spacer 410 disposed over the first substrate 101.In addition, the display device 100 further includes a first alignmentlayer 148 disposed over the first substrate 101 and a second alignmentlayer 150 disposed over the second substrate 103.

In the embodiment shown in FIG. 2A, the first substrate 101 is a colorfilter substrate, and the second substrate 103 is a transistorsubstrate. In particular, the first substrate 101, which serves as acolor filter substrate, may include a first transparent substrate 126, alight-shielding layer 128 disposed over the first transparent substrate126 and a color filter layer 130 disposed over the light-shielding layer128. The first transparent substrate 126 may include, but is not limitedto, a glass substrate, a ceramic substrate, a plastic substrate, or anyother suitable transparent substrate. The color filter layer 130 mayinclude, but is not limited to, a red color filter layer, a green colorfilter layer, a blue color filter layer, or any other suitable colorfilter layer. In addition, the second substrate 103, which serves as atransistor substrate, may include a transparent substrate. The materialof the transparent substrate may include the aforementioned material ofthe first transparent substrate 126. The material of the firsttransparent substrate 126 may be the same as or different from that ofthe transparent substrate of the second substrate 103. In addition, atransistor such as a thin film transistor (not shown) is disposed in orover the transparent substrate of the second substrate 103. Thistransistor is used to control the pixels.

The main spacer 142 and the sub-spacer 410 disposed over the firstsubstrate 101 are used to space the first substrate 101 apart from thesecond substrate 103. Therefore, the liquid-crystal material 138 may bedisposed between the first substrate 101 and second substrate 103. Sincethe main spacer 142 is the main structure used to space the firstsubstrate 101 apart from the second substrate 103, whereas thesub-spacer 410 is the structure used to prevent the first substrate 101from touching the second substrate 103 when the display device 100 ispressed or touched, the height of the main spacer 142 is higher than theheight of the sub-spacer 410. In addition, the main spacer 142 has a topsurface 142T far from the first substrate 101 and a bottom surface 142Badjacent to the first substrate 101. The sub-spacer 410 also has a topsurface 410T far from the first substrate 101 and a bottom surface 410Badjacent to the first substrate 101. The material of the main spacer 142and sub-spacer 410 may independently include, but is not limited to, aresist such as a positive resist or a negative resist. The main spacer142 and the sub-spacer 410 may be formed by the same photolithographyand/or etching steps. However, the main spacer 142 and the sub-spacer410 may be formed by different photolithography and/or etching steps. Inone embodiment, the photolithography steps may include resistpatterning. The resist patterning may include steps such as resistcoating, soft baking, mask alignment, pattern exposure, post-exposurebaking, resist developing and hard baking. The etching step may includereactive ion etch (ME), plasma etch, or any other suitable etching step.

The first alignment layer 148 and second alignment layer 150 are layersused to induce the liquid-crystal molecules to align in a specificdirection. The materials of each of the first alignment layer 148 andsecond alignment layer 150 may independently include, but are notlimited to, polyimide, or any other suitable alignment material. Thefirst alignment layer 148 is disposed over the first substrate 101, themain spacer 142 and the sub-spacer 410. In addition, the first alignmentlayer 148 disposed over the top surface 142T of the main spacer 142 maydirectly contact the second alignment layer 150.

In FIGS. 2A-2C, FIG. 2B is a top view of a display device 100 inaccordance with some embodiments of the present disclosure and FIG. 2Cis a side view of this display device 100. As shown in FIGS. 2A-2C, inthe process of alignment or transportation, since the first alignmentlayer 148 disposed over the top surface 142T of the main spacer 142 maydirectly contact the second alignment layer 150, a rough region 412would be formed in the region of the second alignment layer 150corresponding to the top surface 142T of the main spacer 142. The areaof the rough region 412 may be larger than the area of the top surface142T of the main spacer 142. In other words, the second alignment layer150 includes a rough region 412 corresponding to the main spacer 142.The roughness of the rough region 412 of the second alignment layer 150is different from the roughness of other regions of the second alignmentlayer 150. In addition, the distance D13 between a top surface 142T ofthe main spacer 142 to the edge of the rough region 412 ranges fromabout 0 μm to 12 μm, for example less than about 11.5 μm. In particular,the distance D13 is the distance between the projection edge 142TE ofthe top surface 142T of the main spacer 142 on the first substrate 101to the edge 142E of the rough region 412.

Since the alignment degree of the rough region 412 of the secondalignment layer 150 is different from the alignment degree of otherregions of the second alignment layer 150, the arrangement of theliquid-crystal molecules corresponding to the rough region 412 isdifferent from the arrangement of the liquid-crystal moleculescorresponding to other regions of the second alignment layer 150, whichin turn results in light leakage in the display device 100 and adecrease of the contrast. Therefore, the present disclosure utilizes theenlarged portion 406 of the light-shielding layer 128 disposed at theregion corresponding to the rough region 412 in the display device 100to shield the region in the display device 100 where light leakage mayoccur to further improve the contrast of the display device.

As shown in FIGS. 2B-2C, the enlarged portion 406 of the light-shieldinglayer 128 may include a main enlarged portion 406A and a sub-enlargedportion 406B. The main spacer 142 is disposed corresponding to the mainenlarged portion 406A, and the sub-spacer 410 is disposed correspondingto the sub-enlarged portion 406B. In addition, the main enlarged portion406A and the sub-enlarged portion 406B are both disposed at theintersection 408 of two of the adjacent sub-pixels 402. In other words,the main enlarged portion 406A and the sub-enlarged portion 406B areboth disposed at the intersection 408 of the column of matrix portion404C and row of matrix portion 404R.

By disposing the main spacer 142 corresponding to the main enlargedportion 406A, the main enlarged portion 406A may shield against lightleakage in the rough region 412, which corresponds to the main spacer142. In one embodiment, the light-shielding layer 128 including the mainenlarged portion 406A may completely shield the rough region 412.

In addition, in order to make the main enlarged portion 406A be able toeffectively shield against light leakage, the distance D14 between theprojection edge 142BE of the bottom surface 142B of the main spacer 142on the first substrate 101 to the edge 406AE of the main enlargedportion 406A may range from about 5 μm to 15 μm, preferably from about11.5 μm to 12.5 μm. It should be noted that, if the distance D14 is toogreat, for example greater than 15 μm, the pixel aperture region of thedisplay device 100 would be too small and the mura issue would be theresult. However, if the distance D14 is too small, for example smallerthan 5 μm, the area of the main enlarged portion 406A would be too smallto effectively shield against light leakage. In addition, as shown inFIG. 2B, the distance D14 is greater than the distance D13 such that thelight-shielding layer 128 including the main enlarged portion 406A maycompletely shield the rough region 412.

The sub-enlarged portion 406B may shield against light leakage in of thedisplay device 100 to further improve the contrast of the display device100. For example, in one embodiment, the distance D15 corresponding tothe first side S4 of the sub-spacer 410 in the display device 100 is 5.5μm, and the distance D16 corresponding to the second side S5, which isopposite to the first side S4, of the sub-spacer 410 in the displaydevice 100 is 8.5 μm. If the distance D15, which corresponds to thefirst side S4 of the sub-spacer 410 in the display device 100, isincreased to 8.75 μm, and the distance D16, which corresponds to thesecond side S5 of the sub-spacer 410, is increased to 10.75 μm, thecontrast of the display device 100 would be increased from 881 to 994.

As illustrated in FIGS. 2A-2C, in one embodiment, the first alignmentlayer 148 and the second alignment layer 150 are aligned by a rubbingprocess. However, when aligning the first alignment layer 148 by therubbing process, it is hard to effectively align the portion of thefirst alignment layer 148 around the bottom edge 142BE of the mainspacer 142 and the bottom edge 410BE of the sub-spacer 410. Therefore,the alignment degree of the first alignment layer 148 around the bottomedge 142BE and the bottom edge 410BE is different from the alignmentdegree of other regions of the first alignment layer 148.

The difference in the alignment degree would make the arrangements ofthe liquid-crystal molecules corresponding to the bottom edge 142BE ofthe main spacer 142 and the bottom edge 410BE of the sub-spacer 410different from the arrangement of the liquid-crystal moleculescorresponding to other region of the first alignment layer 148, which inturn results in light leakage issue of the display device 100 anddecreases the contrast. Therefore, in addition to the main enlargedportion 406A disposed corresponding to the main spacer 142 in thedisplay device 100, the present disclosure utilizes the sub-enlargedportion 406B of the light-shielding layer 128 disposed at the regioncorresponding to the bottom edge 410BE of the sub-spacer 410 and aroundthe bottom edge 410BE to shield the region in the display device 100where the light leakage issue may occur to further improve the contrastof the display device.

As seen in FIGS. 2B and 2C, the sub-spacer 410 is disposed correspondingto a sub-enlarged portion 406B such that the sub-enlarged portion 406Bmay shield against light leakage that occurs at the region correspondingto the bottom edge 410BE of the sub-spacer 410 and around the bottomedge 410BE.

The sub-spacer 410 includes a bottom surface 410B adjacent to the firstsubstrate 101, as shown in FIG. 2A. In addition, FIGS. 2B and 2C showthat in order to make the sub-enlarged portion 406B be able toeffectively shield against light leakage, the distances D15 or D16between the edge 410BE of the bottom surface 410B of the sub-spacer 410to the edge 406BE of the sub-enlarged portion 406B may range from about5 μm to 10 μm. In particular, the distances D15 or D16 is the maximumdistance between the projection edge 410BE of the bottom surface 410B ofthe sub-spacer 410 on the first substrate 101 to the projection edge406BE of the sub-enlarged portion 406B on the first substrate 101. Itshould be noted that, if the distances D15 or D16 are too great, forexample greater than 10 μm, the pixel aperture region of the displaydevice 100 would be too small and the mura issue would result. However,if the distances D15 or D16 are too small, for example smaller than 5μm, the area of the sub-enlarged portion 406B would be too small toeffectively shield against light leakage.

In addition, the rubbing process would result in different alignmentdegrees of the first alignment layer 148 around the bottom edge 142BE ofthe main spacer 142 and the bottom edge 410BE of the sub-spacer 410 atthe opposite side of the main spacer 142 and the sub-spacer 410. Inparticular, if the rubbing process includes a plurality of rubbingsteps, the following discussion is based on the rubbing direction of thelast rubbing step (for example the rubbing direction 414 in FIGS.2B-2C). The side of the sub-spacer 410 facing the rubbing direction 414is the first side S4 (also referred to as the windward side). The sideof the sub-spacer 410 that backs on to the rubbing direction 414 is thesecond side S5 (also referred to as the leeward side). The first side S4(windward side) is opposite to the second side S5 (leeward side). Sincethe first alignment layer 148 around the bottom edge 410BE at the firstside S4 (windward side) faces the rubbing direction 414, and the firstalignment layer 148 around the bottom edge 410BE at the second side S5(leeward side) backs on to the rubbing direction 414, the alignmentdegree of the first alignment layer 148 at the first side S4 (windwardside) is greater than the alignment degree of the first alignment layer148 at the second side S5 (leeward side). The difference in thealignment degree would result in a different degree of light leakage atthe first side S4 (windward side) and the second side S5 (leeward side)around the bottom edge 410BE of the sub-spacer 410 in the display device100.

Therefore, the distances D15 or D16 between the edge 410BE of the bottomsurface 410B of the sub-spacer 410 to the edge 406BE of the sub-enlargedportion 406B may be different at the first side S4 (windward side) andthe second side S5 (leeward side) to correspond the different degree oflight leakage. In one embodiment, the distance D15 between the edge410BE of the bottom surface 410B of the sub-spacer 410 to the edge 406BEof the sub-enlarged portion 406B at the first side S4 (windward side)may range from about 5 μm to 8 μm, and the distance D16 between the edge410BE of the bottom surface 410B of the sub-spacer 410 to the edge 406BEof the sub-enlarged portion 406B at the second side S5 (leeward side)may range from about 5 μm to 10 μm. It should be noted that, if thedistances D15 or D16 are too great, for example greater than 10 μm, thepixel aperture region of the display device 100 would be too small andthe mura issue would result. However, if the distances D15 or D16 aretoo small, for example smaller than 5 μm, the area of the sub-enlargedportion 406B would be too small to effectively shield against lightleakage.

The sub-enlarged portion 406B may shield against light leakage in thedisplay device 100 to further improve the contrast of the display device100. For example, in one embodiment, the distance D15 corresponding tothe first side S4 of the sub-spacer 410 in the display device 100 is 5μm, and the distance D16 corresponding to the second side S5, which isopposite to the first side S4, of the sub-spacer 410 in the displaydevice 100 is also 5 μm. If the distance D15, which corresponds to thefirst side S4 of the sub-spacer 410 in the display device 100, isincreased to 5.5 μm, and the distance D16, which corresponds to thesecond side S5 of the sub-spacer 410, is also increased to 5.5 μm, thecontrast of the display device 100 would be greatly increased from 393to 847.

FIGS. 3A-3B present a top view and a side view of a display device 100in accordance with another embodiment of the present disclosure. In thisembodiment, the first alignment layer 148 and the second alignment layer150 may be aligned by a photo-alignment process. Alternatively, thefirst alignment layer 148 may be aligned by the photo-alignment process,whereas the second alignment layer 150 may be aligned by the rubbingprocess. In other words, the first alignment layer 148 and the secondalignment layer 150 are not both aligned by the rubbing process aspreviously described. In the photo-alignment process, the alignmentlayer is aligned by being irradiated by a polarized light. The incidentdirection of the linear polarized light would determine the alignmentdirection of the alignment layer. The angle between the incidentdirection of the linear polarized light and the alignment layer wouldaffect the pre-tilt angle of the liquid-crystal molecules when beingaligned.

Since the alignment degree of the first alignment layer 148 around thebottom edge 142BE of the main spacer 142 and the bottom edge 410BE ofthe sub-spacer 410 would not be different from the alignment degree ofother regions of the first alignment layer 148 in the photo-alignmentprocess, the light-shielding layer 128 disposed at the regioncorresponding to the sub-spacer 410 in the pixel-displaying region 104does not include the sub-enlarged portion 406B or any enlarged portion406, as shown in FIGS. 3A and 3B.

However, since the size and the position of the sub-spacer 410 may varybetween different manufacturing batches, and the position may also shiftwhen assembling the first substrate 101 and the second substrate 103,the sub-spacer 410 should be spaced apart from the adjacent sub-pixels402 by a certain distance. For example, in one embodiment, the minimumdistance D17 between the projection edge 410BE of the bottom surface410B of the sub-spacer 410 on the first substrate 101 to the sub-pixels402 may range from about 3 μm to 8 μm. It should be noted that, if thedistance D17 is too great, for example greater than 8 μm, the pixelaperture region of the display device 100 would be too small and themura issue would result. However, if the distance D17 is too small, forexample smaller than 3 μm, the sub-spacer 410 may be exposed due to thevariation in the manufacturing, which in turn may deteriorate thedisplay quality.

In addition, the excess sub-spacer 410 may hinder the improvement of theaperture ratio of the pixel 400 of the display device 100, which in turnhinders the improvement of the transparency of the display device 100.Therefore, in one embodiment of the present disclosure, as shown in FIG.4, each of the pixels 400 in the display device 100 includes threesub-pixels 402, and the ratio of the amount of the plurality ofsub-spacers 410 to the amount of the sub-pixels 402 is 1:3. It should benoted that, if the amount of the sub-spacers 410 is too large, forexample if the ratio of the amount of the sub-spacers 410 to the amountof the sub-pixels 402 is larger than 1:3 (namely more than onesub-spacers 410 per three sub-pixels 402), it would be hard to improvethe aperture ratio of the pixel 400 of the display device 100, and itwould also be hard to improve the transparency of the display device100. However, if the amount of the sub-spacers 410 is too small, forexample if the ratio of the amount of the sub-spacers 410 to the amountof the sub-pixels 402 is smaller than 1:3 (namely less than onesub-spacers 410 per three sub-pixels 402), the sub-pixels 402 cannotprovide good structural stability of the display device 100.

In addition, the ratio of the amount of the sub-spacers 410 to theamount of the sub-pixels 402 would affect the contrast and transparencyof the display device 100. For example, in one embodiment, if the ratioof the amount of the sub-spacers 410 to the amount of the sub-pixels 402is altered from 1:1 to 1:3, the contrast of the display device 100 wouldbe increased from 909 to 998, and the transparency of the display device100 would be increased from 2.8% to 3.1. Accordingly, the specific ratioof the amount of the sub-spacers 410 to the amount of the sub-pixels 402in the present disclosure (namely 1:3) has the unexpected effectscompared to the ratio of the amount of the sub-spacers 410 to the amountof the sub-pixels 402 in the conventional display device (namely 1:1).

As illustrated in FIG. 4, any one of the sub-spacers 410 is spaced apartfrom another most-adjacent sub-spacer 410 by three sub-pixel columns,and this configuration may prevent the mura issue.

In addition, the difference between the embodiment shown in FIG. 4 andthe embodiments shown in FIG. 1A-3B is that the adjacent sub-pixel rows402R have different incline direction. In particular, as shown in FIG.4, all of the sub-pixels 402 in the sub-pixel row 402R1 incline towardthe left side of FIG. 4, whereas all of the sub-pixels 402 in thesub-pixel row 402R2, which is adjacent to the sub-pixel row 402R1,incline toward the right side of FIG. 4. This configuration may furtherreduce the parallax of the display device 100.

In addition, by adjusting the specific amount ratio or the specificconfiguration of the enlarged portion 406, the present disclosure mayfurther prevent the mura issue of visible stripe resulted from theenlarged portion 406 to further improve the display quality. Inparticular, in one embodiment, each of the pixels in the display deviceincludes three sub-pixels, and the light-shielding layer includes aplurality of enlarged portions. The ratio of the amount of the enlargedportions to the amount of the sub-pixels may range from about 1:12 to1:18. This specific amount ratio may further prevent the mura issue.

It should be noted that, if the amount of the enlarged portion is toolarge, for example if the ratio of the amount of the enlarged portion tothe amount of the sub-pixels is larger than 1:12 (namely more than oneenlarged portion per twelve sub-pixels), the display device 100 wouldhave insufficient transparency. However, if the amount of the enlargedportion is too small, for example if the ratio of the amount of theenlarged portion to the amount of the sub-pixels is smaller than 1:18(namely less than one enlarged portion per eighteen sub-pixels), theenlarged portion may result in the mura issue of visible stripe.

The present disclosure will provide two embodiments in the followingdescription to describe the enlarged portion with the specific amountratio and the specific configurations in more detail. FIG. 5 is a topview of a display device 100 in accordance with another embodiment ofthe present disclosure. FIG. 5 shows a sub-pixel region 416 whichconsists of 108 sub-pixels 402. In addition, the sub-pixel region 416has 18 sub-pixel columns 402C and 6 sub-pixel rows 402R. In thissub-pixel region 416, the ratio of the amount of the enlarged portions406 to the amount of the sub-pixels 402 is 1:18. In addition, theenlarged portion 406 is disposed between two of the sub-pixel columns402C and is disposed between two of the sub-pixel rows 402R.

In addition, in the sub-pixel region 416, the amount of the enlargedportion 406 between two of the adjacent sub-pixel columns 402C is one orless, and the amount of the enlarged portion 406 between two of theadjacent sub-pixel rows 402R is one or less. In other words, there isonly one enlarged portion 406 between every two adjacent sub-pixelcolumns 402C, and there is only one enlarged portion 406 between everytwo adjacent sub-pixel rows 402R. In addition, any one of the enlargedportions 406 is spaced apart from another most-adjacent enlarged portion406 by three sub-pixel columns 402C.

Furthermore, the display device 100 in FIG. 5 includes at least one mainspacer 142, and all the region corresponding to the main spacer 142 hasthe enlarged portion 406. In addition, the display device 100 in FIG. 5further includes at least one sub-spacer 410, and a portion of theregions corresponding to the enlarged portions 406 has the sub-spacer410. However, another portion of the regions corresponding to theenlarged portions 406 does not have the main spacer 142 and thesub-spacer 410. In addition, a portion of the region corresponding tothe sub-spacers 410 does not have the enlarged portions 406.

The enlarged portion 406 with the specific amount ratio and the specificconfigurations in FIG. 5 may further prevent the mura issue and mayimprove the display quality.

FIG. 6 is a top view of a display device 100 in accordance with anotherembodiment of the present disclosure. FIG. 6 shows a sub-pixel region416 which consists of 12 sub-pixels 402. In addition, the sub-pixelregion 416 has 6 sub-pixel columns 402C and 2 sub-pixel rows 402R. Inthis sub-pixel region 416, the ratio of the amount of the enlargedportions 406 to the amount of the sub-pixels 402 is 1:12. The enlargedportion 406 is disposed at one of the corners in each of the sub-pixelregion 416.

Furthermore, the display device 100 in FIG. 6 includes at least one mainspacer 142, and all the region corresponding to the main spacer 142 hasthe enlarged portion 406. In addition, the display device 100 in FIG. 6further includes at least one sub-spacer 410, and a portion of theregions corresponding to the enlarged portions 406 has the sub-spacer410. However, another portion of the regions corresponding to theenlarged portions 406 does not have the main spacer 142 and thesub-spacer 410. In addition, a portion of the region corresponding tothe sub-spacers 410 does not have the enlarged portions 406 (not shownin FIG. 6).

The enlarged portion 406 with the specific amount ratio and the specificconfigurations in FIG. 6 may further prevent the mura issue and mayimprove the display quality.

It should be noted that, although all the sub-pixels in the adjacentsub-pixel rows are arranged with the same direction in the embodimentsshown in FIGS. 1A-3B and 5-6, those skilled in the art will appreciatethat the sub-pixels in the display device of the present disclosure maybe arranged by the configuration shown in FIG. 4. In other words, theadjacent sub-pixel rows may have different incline direction. Therefore,the exemplary embodiments put forth in FIGS. 1A-3B and 5-6 are merelyfor the purpose of illustration, and the inventive concept may beembodied in various forms without being limited to the exemplaryembodiments as shown in FIGS. 1A-3B and 5-6.

In addition, although the above description merely illustratesembodiments with the first substrate being a color filter substrate andthe second substrate being a transistor substrate such as theembodiments shown in FIGS. 1A-6, those skilled in the art willappreciate that the first substrate may be a transistor substrate withthe second substrate being a color filter substrate, as shown in FIG. 7.Therefore, the exemplary embodiments put forth in FIGS. 1A-6 are merelyfor the purpose of illustration, and the inventive concept may beembodied in various forms without being limited to the exemplaryembodiments as shown in FIGS. 1A-6.

As illustrated by FIG. 7, the first substrate 101 of the display device100 is a transistor substrate, and the second substrate 103 is a colorfilter substrate. The main spacer 142 and the sub-spacer 410 disposedover the first substrate 101, which serves as a transistor substrate.The first alignment layer 148 is disposed over the first substrate 101,the main spacer 142 and the sub-spacer 410. The second substrate 103,which serves as a color filter substrate, may include a secondtransparent substrate 134, a light-shielding layer 128 disposed over thesecond transparent substrate 134 and a color filter layer 130 disposedover the light-shielding layer 128. The second alignment layer 150 isdisposed over the color filter layer 130. The material of the secondtransparent substrate 134 may include the same material of theaforementioned first transparent substrate 126.

The embodiments of the present disclosure change the configuration ofthe wire in the display device to reduce the area occupied by the wirein the integrated circuit. In addition, the present disclosure alsoutilizes a patterned test pad to improve the reliability and yield ofthe display device.

First, a display device comprises a driving unit, a gate-drivingcircuit, a test pad and wires. The gate-driving circuit, a driving unit,the test pad and the wires are disposed on a substrate. The driving unitmay be, but is not limited to, a driving unit. The driving unit includesthe gate-signal output bump. The gate-signal output bump is electricallyconnected to the gate-driving circuit through one wire and iselectrically connected to the test pad through another wire.Accordingly, the two wires mentioned above occupy two regions of thedriving unit (corresponding to region 113A and region 113B in FIG. 8B).When the amount of signal output contacts of the output bump increasesas the resolution of the display panel is enhanced, not only the areaused to accommodate the wire electrically connecting to the signaloutput contacts of the output bump would be insufficient, but also theportion of the substrate below the chip in which the wires pass throughwould be insufficient.

Therefore, in order to reduce the area occupied by the wire, anotherconfiguration of the wire in the display device is provided by thepresent disclosure. FIG. 8A is a top view of a display device inaccordance with some embodiments of the present disclosure. As shown inFIG. 8A, the display device 100 includes a display region 104 and anon-display region 105 adjacent to the display region 104. The displayregion 104 is the region in the display device 100 in which the pixelsincluding transistors display an image. The transistor may include, butis not limited to, an amorphous silicon thin film transistor or an LTPSthin film transistor. Therefore, the display region 104 is also referredto as a pixel-displaying region 104. The non-display region 105 is theregion in the display device 100 except or other than the display region104. In this embodiment, the non-display region 105 surrounds orencloses the display region 104. In addition, the non-display region 105includes a gate-driving circuit (such as gate driver on panel, GOP) 107disposed at the two opposite sides of the display region 104, a drivingunit 106 and a test pad 109 disposed in the out lead bonding (OLB)region 115. In addition, the non-display region 105 further comprises awire 110, and a portion of the wire 110 is disposed in the out leadbonding region 115. In other embodiments, the gate-driving circuit 107may be disposed only at one side of the display region 104.

The display device 100 may include, but is not limited to, aliquid-crystal display, such as a thin film transistor liquid-crystaldisplay. The driving unit 106 may provide a source signal to the pixels(not shown) in the display region 104 and/or provide a gate signal tothe gate-driving circuit 107. The gate-driving circuit 107 may provide ascanning pulse signal to the pixels in the display region 104 andcontrol the pixels (not shown) disposed in the display region 104cooperating with the aforementioned source signal to display an image inthe display device 100. The gate-driving circuit 107 may comprise, butis not limited to, a gate-on-panel (GOP) or any other suitablegate-driving circuit.

In addition, the driving unit 106 is electrically connected to thegate-driving circuit 107 through the test pad 109. The test pad 109 maybe electrically connected to the gate-driving circuit 107 and thedriving unit 106 by any suitable method. For example, In one embodiment,as shown in FIG. 8A, the test pad 109 is electrically connected to thegate-driving circuit 107 and the driving unit 106 through the wire 110.

By electrically connecting the driving unit 106 to the gate-drivingcircuit 107 through the test pad 109, the present disclosure may reducethe area occupied by the wire 110 in the driving unit 106, particular asillustrated in FIG. 8B, which is an enlarged figure of a portion of thedisplay device 100 in FIG. 8A. As shown in FIG. 8B, the gate-signaloutput bump 111 of the driving unit 106 is electrically connected to thetest pad 109 through the wire 110B. Then the test pad 109 iselectrically connected to the gate-driving circuit 107 through anotherwire 110A. Compared to the aforementioned display device known to theapplicant, the wires 110A and 110B in the known display device passthrough the regions 113A and 113B respectively. Therefore, the area ofthe regions 113A and 113B must be occupied at the lower portion of thedriving unit 106. However, the wire 110 of the present disclosure onlyoccupies the area of the region 113B in the driving unit 106 and doesnot occupy the area of the region 113A. As the amount of signal outputwire of the driving unit 106 increases when the resolution of thedisplay panel is enhanced, the region 113A may be used to dispose otheroutput wire. Therefore, the problem of there being insufficient area forthe output wire in the chip such as the driving unit may be solved.

Furthermore, in order to improve the reliability and yield of thedisplay device 100 in FIG. 8A, the test pad 109 of the display device100 in the present disclosure may be a patterned test pad. Inparticular, in the testing step for testing the function of the displaydevice 100, the test pad 109 must be touched by a probe, which wouldresult in a hole in the conductive layer of the test pad 109 when theprobe contacts the test pad 109. The hole in the conductive layer wouldbe corroded and damaged by water and oxygen as time goes by, resultingin an open circuit or a malfunction of the wire between the driving unit106 and the gate-driving circuit 107, which in turn would lower thereliability and yield of the display device 100. In order to solve theabove technical problem, the test pad of the present disclosure may bepatterned to be divided into a plurality of functional regions andsections which are separated apart from each other, and these functionalregions and sections are electrically connected to each other through aconnecting layer.

Referring to FIG. 9 and FIG. 10A, FIG. 9 is a top view of a test pad 109in accordance with some embodiments of the present disclosure and FIG.10A is a cross-sectional view of the test pad 109 along line 3-3 in FIG.9. As shown in FIGS. 9 and 10A, the test pad 109 includes a conductivelayer M disposed over a substrate 102, and the conductive layer Mcomprises a first region 300 and a second region 302. The first region300 of the conductive layer M is used to transmit the signal between twowires 110. The second region 302 of the conductive layer M is used tocontact the probe in the testing step. The first region 300 of theconductive layer M directly contacts the wire 110, whereas the secondregion 302 of the conductive layer M is separated apart from the firstregion 300 of the conductive layer M. In other words, the first region300 of the conductive layer M does not connect or contact the secondregion 302 of the conductive layer M. For example, the first region 300of the conductive layer M is separated apart from the second region 302of the conductive layer M by a main gap 304. In addition, the secondregion 302 of the conductive layer M is separated apart from the wire110. In other words, the second region 302 of the conductive layer Mdoes not connect or contact the first region 300 of the conductive layerM and the wire 110. The first region 300 is electrically connected tothe second region 302 by another connecting layer through a contact via.

Since the second region 302 of the conductive layer M, which is used tocontact the probe in the testing step, is separated apart from the firstregion 300 of the conductive layer M, which is used to transmit thesignal, and the wire 110, the corrosion after the testing step islimited to the second region 302 of the conductive layer M. Therefore,the first region 300 of the conductive layer M and the wire 110 wouldnot be corroded. Accordingly, even if the corrosion happens after thetesting step, the patterned test pad 109 of the present disclosure maystill transmit signals through the first region 300 of the conductivelayer M and the wire 110. Therefore, the patterned test pad 109 mayimprove the reliability and yield of the display device 100.

In addition, the ratio of the area of the first region 300 to that ofthe second region 302 of the conductive layer M ranges from about 2 to1000, for example from about 4 to 10. If the area ratio of the firstregion 300 to the second region 302 is too large, for example greaterthan 1000, the area of the second region 302 of the conductive layer Mwhich is used to contact the probe would be too small, such that itwould be difficult to perform the testing step. However, if the arearatio of the first region 300 to the second region 302 is too small, forexample smaller than 2, the area of the first region 300 of theconductive layer M which is used to transmit the signal would be toosmall, which in turn increases the resistance. In addition, the size ofthe test pad 109 may range from about 100 μm to 1000 μm, for examplefrom about 500 μm to 800 μm. The size of the test pad 109 refers to thelength L or width W of the test pad 109.

Referring to FIG. 10A, the conductive layer M is disposed over thesubstrate 102. The conductive layer M may comprise, but is not limitedto, a metal layer. The material of the metal layer may include, but isnot limited to, a single layer or multiple layers of copper, aluminum,tungsten, gold, chromium, nickel, platinum, titanium, iridium, rhodium,a combination thereof, an alloy thereof, or other metal materials withgood conductivity. In other embodiments, the conductive layer M includesa nonmetal material. The conductive layer M may include any conductivematerial and would suffer a corrosion expansion after being corroded,and the conductive material could be used as the conductive layer M ofthe embodiments mentioned above. For example, in the embodiment shown inFIG. 10A, the conductive layer M is a double-layer conductive layer,which includes the first conductive layer M1 and the second conductivelayer M2. In one embodiment, the materials of the first conductive layerM1 and the second conductive layer M2 are the same. However, in otherembodiments, the materials of the first conductive layer M1 and thesecond conductive layer M2 may be different. An interlayer dielectric(ILD) layer 206A is disposed between the first conductive layer M1 andthe second conductive layer M2. The first conductive layer M1 and thesecond conductive layer M2 have the same pattern, and the correspondingpatterns are electrically connected to each other through the via V1 inthe interlayer dielectric layer 206A. The material of the interlayerdielectric layer 206A may include, but is not limited to, silicon oxide,silicon nitride, silicon oxynitride, boron phosphorus silicate glass(BPSG), phosphorus silicate glass (PSG), spin-on glass (SOG), or anyother suitable dielectric material, or a combination thereof. Thematerial which electrically connects the first conductive layer M1 andthe second conductive layer M2 through the via V1 may include, but isnot limited to, the material of the first conductive layer M1, thematerial of the second conductive layer M2, a combination thereof,copper, aluminum, tungsten, doped poly-silicon, or any other suitableconductive material, or a combination thereof.

In addition, in the embodiment shown in FIG. 10A, the first region 300of the conductive layer M may be electrically connected to the secondregion 302 of the conductive layer M by a connecting layer 211. Sincethe connecting layer 211 has a higher anticorrosive ability than theconductive layer, and the first region 300 and the second region 302 areelectrically connect by a connecting layer 211 rather than by directcontact, the connecting layer 211 would protect the conductive layerfrom being corroded by water and oxygen. The material of the connectinglayer 211 may include, but is not limited to, transparent conductivematerial such as indium tin oxide (ITO), tin oxide (TO), indium zincoxide (IZO), indium gallium zinc oxide (IGZO), indium tin zinc oxide(ITZO), antimony tin oxide (ATO), antimony zinc oxide (AZO), acombination thereof, or any other suitable transparent conductive oxideswith higher anticorrosive ability. The connecting layer 211 may beelectrically connected to the conductive layer M1 or the conductivelayer M2 by the via V2 in the interlayer dielectric layer 206B toelectrically connect the first region 300 of the conductive layer M tothe second region 302 of the conductive layer M.

In addition, the conductive layer M may also be a single-layerconductive layer. As shown in FIG. 10B, only one single conductive layerM is disposed over the substrate 102, and the first region 300 of theconductive layer M may be electrically connected to the second region302 of the conductive layer M by the connecting layer 211 through thevia. For example, the connecting layer 211 may be electrically connectedto the conductive layer M by the via V3 in the interlayer dielectriclayer 206 to electrically connect the first region 300 of the conductivelayer M to the second region 302 of the conductive layer M.

Referring to FIG. 9, in the embodiment shown in FIG. 9, the main gap 304may surround the second region 302 of the conductive layer M. The widthof the main gap 304 may range from about 10 μm to 100 μm, for examplefrom about 20 μm to 40 μm. Alternatively, the ratio of the width of themain gap 304 to the width W of the test pad 109 may range from about0.01 to 0.25, for example from about 0.025 to 0.1. If the width of themain gap 304 is too large, for example if the width of the main gap 304is larger than 100 μm or the ratio of the width of the main gap 304 tothe width W of the test pad 109 is larger than 0.25, the main gap 304would occupy too much area of the test pad 109, which in turn reducesthe area of the conductive layer M and increases the resistance.However, if the width of the main gap 304 is too small, for example ifthe width of the main gap 304 is smaller than 10 μm or the ratio of thewidth of the main gap 304 to the width W of the test pad 109 is smallerthan 0.01, the main gap 304 could not effectively prevent the firstregion 300 of the conductive layer M from being corroded. For example,when the width of the main gap 304 is too small, if the probe contactsthe main gap 304 due to shifting, the first region 300 of the conductivelayer M would probably be exposed such that the first region 300 of theconductive layer M would be corroded.

In addition, the first region 300 of the conductive layer M alsosurrounds or encloses the second region 302 of the conductive layer M.The first region 300 of the conductive layer M may be divided into aplurality of sections which are separated apart from each other by oneor more first gaps 306. In other words, the plurality of sections suchas the sections 300A and 300B shown in FIG. 9 does not contact eachother. The plurality of sections 300A and 300B which are separated apartfrom each other may further improve the reliability and yield of thedisplay device 100. In particular, in the testing step, the probe maycontact the first region 300 of the conductive layer M due to shifting.Therefore, the first region 300 of the conductive layer M may also becorroded after the testing step. The plurality of sections 300A and 300Bwhich are separated apart from each other may limit the corrosion in thesection touched by the probe, and the signal may still be transmitted byother sections of the first region 300 of the conductive layer M whichare not corroded. For example, if the probe contacts section 300A, sincesections 300A and 300B are separated apart from each other, thecorrosion is limited to section 300A, and the signal can still betransmitted by section 300B, which is not corroded. Therefore, dividingthe first region 300 of the conductive layer M into a plurality ofsections which are separated apart from each other by one or more firstgaps 306 may further improve the reliability and yield of the displaydevice 100.

The width of the first gap 306 may range from about 3 μm to 50 μm, forexample from about 10 μm to 20 μm. Alternatively, the ratio of the widthof the first gap 306 to the width W of the test pad 109 may range fromabout 0.0033 to 0.1, for example from about 0.01 to 0.02. If the widthof the first gap 306 is too large, for example if the width of the firstgap 306 is larger than 50 μm or the ratio of the width of the first gap306 to the width W of the test pad 109 is larger than 0.1, the first gap306 would occupy too much area of the test pad 109, which in turnreduces the area of the conductive layer M and increases the resistance.However, if the width of the first gap 306 is too small, for example ifthe width of the first gap 306 is smaller than 3 μm or the ratio of thewidth of the first gap 306 to the width W of the test pad 109 is smallerthan 0.0033, the first gap 306 could not effectively separate thesections 300A and 300B.

In addition, the plurality of sections 300A and 300B in the first region300, which are separated apart from each other, may further include oneor more in-section gaps 308. The in-section gaps 308 may divide thesections 300A and 300B into a plurality of sub-sections. Thesub-sections are substantially separated apart from each other, and thesub-sections connect to each other only by a small part or a smallportion of the sub-sections. For example, section 300A may be dividedinto a plurality of sub-sections 300Aa and 300Ab by a plurality ofin-section gaps 308. The sub-sections 300Aa and 300Ab are substantiallyseparated apart from each other, and the sub-sections 300Aa and 300Abphysically connect to each other only by a small part or a small portionlocated at the upper left and lower left in the figure. The plurality ofthe sub-sections 300Aa and 300Ab which are substantially separated apartfrom each other may further improve the reliability and yield of thedisplay device 100. For example, if the probe contacts the sub-section300Ab, since the sub-sections 300Aa and 300Ab connect to each other onlyby a small part or a small portion, the corrosion is limited tosub-section 300Ab. Even if the sub-section 300Ab is damaged due to thecorrosion, the signal may still be transmitted by the sub-section 300Aawhich are not corroded. Therefore, dividing the plurality of sections300A and 300B into a plurality of sub-sections such as sub-sections300Aa and 300Ab by the in-section gaps 308 may further improve thereliability and yield of the display device 100.

The width of the in-section gap 308 may range from about 3 μm to 50 μm,for example from about 10 μm to 20 μm. Alternatively, the ratio of thewidth of the in-section gap 308 to the width W of the test pad 109 mayrange from about 0.0033 to 0.1, for example from about 0.01 to 0.02. Ifthe width of the in-section gap 308 is too large, for example if thewidth of the in-section gap 308 is larger than 50 μm or the ratio of thewidth of the in-section gap 308 to the width W of the test pad 109 islarger than 0.1, the in-section gap 308 would occupy too much area ofthe test pad 109, which in turn reduces the area of the conductive layerM and increases the resistance. However, if the width of the in-sectiongap 308 is too small, for example if the width of the in-section gap 308is smaller than 3 μm or the ratio of the width of the in-section gap 308to the width W of the test pad 109 is smaller than 0.0033, thesub-sections 300Aa and 300Ab would be too close and the in-section gap308 could not effectively prevent corrosion.

Referring to FIG. 9, the material of the wire 110 may include, but isnot limited to, a single layer or multiple layers of copper, aluminum,tungsten, gold, chromium, nickel, platinum, titanium, iridium, rhodium,a combination thereof, an alloy thereof, or other metal materials withgood conductivity. In addition, the wire 110 may further include one ormore in-wire gaps 310. In one embodiment, at least one in-wire gap 310connects to at least one first gap 306. The in-wire gap 310 may furtherimprove the reliability and yield of the display device 100. Inparticular, if the corrosion extends from the sections 300 of the firstregion 300 to the first-section wire 110C, the in-wire gap 310 may limitthe corrosion to the first-section wire 110C, and the second-sectionwire 110D would not be corroded. Accordingly, since the wire 110 wouldnot be corroded completely, the in-wire gap 310 may further improve thereliability and yield of the display device 100. In other embodiments,the connecting layer 211 may also be disposed above or overlapped thewire 110.

The width of the in-wire gap 310 may range from about 3 μm to 50 μm, forexample from about 10 μm to 20 μm. Alternatively, the ratio of the widthof the in-wire gap 310 to the width of the wire 110 may range from about0.02 to 0.5, for example from about 0.05 to 0.2. If the width of thein-wire gap 310 is too large, for example if the width of the in-wiregap 310 is larger than 50 μm or the ratio of the width of the in-wiregap 310 to the width of the wire 110 is larger than 0.5, the risk of anopen circuit occurring in the wire 110 would increase due to the overlylarge size of the in-wire gap 310. However, if the width of the in-wiregap 310 is too small, for example if the width of the in-wire gap 310 issmaller than 3 μm or the ratio of the width of the in-wire gap 310 tothe width of the wire 110 is smaller than 0.02, the in-wire gap 310would not effectively prevent the corrosion from extending between thefirst-section wire 110C and the second-section wire 110D at the oppositesides of the in-wire gap 310. Alternatively, the ratio of the length ofthe in-wire gap 310 to the length L of the test pad 109 may range fromabout 0.03 to 3. The length of the in-wire gap 310 may be as short as 3μm. Alternatively, the ratio of the length of the in-wire gap 310 to thelength L of the test pad 109 may be as small as 0.03. The length of thein-wire gap 310 may be as long as the length of the wire 110 in the outlead bonding region 115. If the length of the in-wire gap 310 is tooshort, for example if the length of the in-wire gap 310 being shorterthan 3 μm or the ratio of the length of the in-wire gap 310 to thelength L of the test pad 109 is smaller than 0.03, the in-wire gap 310could not effectively separate the first-section wire 110C and thesecond-section wire 110D. However, length of the in-wire gap 310 cannotbe longer than the length of the wire 110 in the out lead bonding region115.

It should be noted that the exemplary embodiment set forth in FIG. 9 ismerely for the purpose of illustration. In addition to the embodimentset forth in FIG. 9, the test pad could have other patterns as shown inFIGS. 11-14. The inventive concept and scope are not limited to theexemplary embodiment shown in FIG. 9.

Referring to FIG. 11, which is a top view of a test pad in accordancewith another embodiment of the present disclosure. The differencebetween the embodiments shown in FIGS. 9 and 11 is that the secondregion 302 of the conductive layer M is also divided into a plurality ofsections 302A and 302B which are separated apart from each other by oneor more second gaps 312. In other words, the plurality of sections 302Aand 302B do not directly contact each other. In addition, in theembodiment shown in FIG. 4, the first region 300 of the conductive layerM does not include an in-section gap.

The plurality of sections 302A and 302B which are separated apart fromeach other may further improve the reliability and yield of the displaydevice 100. For example, when the probe touches the sections 302A, thecorrosion is limited to section 302A, and the section 302B which is notcorroded could still transmit signal through the via and the connectinglayer. Therefore, the plurality of sections 302A and 302B may furtherimprove the reliability and yield of the display device 100 and mayfurther reduce the resistance.

The width of the second gap 312 may range from about 10 μm to 100 μm,for example from about 30 μm to 50 μm. Alternatively, the ratio of thewidth of the second gap 312 to the width W of the test pad 109 may rangefrom about 0.01 to 0.25, for example from about 0.05 to 0.1. If thewidth of the second gap 312 is too large, for example if the width ofthe second gap 312 is larger than 100 μm or the ratio of the width ofthe second gap 312 to the width W of the test pad 109 is larger than0.25, the second gap 312 would occupy too much area of the test pad 109,which in turn reduces the area of the conductive layer M and increasesthe resistance. However, if the width of the second gap 312 is toosmall, for example if the width of the second gap 312 is smaller than 10μm or the ratio of the width of the second gap 312 to the width W of thetest pad 109 is smaller than 0.01, the second gap 312 could noteffectively separate the sections 302A and 302B.

Referring to FIG. 12, which is a top view of a test pad in accordancewith another embodiment of the present disclosure. In the embodimentshown in FIG. 12, the second region 302 of the conductive layer M isalso divided into a plurality of sections 302A and 302B which areseparated apart from each other by one or more second gaps 312. Thedifference between the embodiment shown in FIG. 12 and the embodimentshown in FIG. 11 is that the second gap 312 of this embodiment isaligned with the first gap 306 and the in-wire gap 310.

Referring to FIG. 13, which is a top view of a test pad in accordancewith another embodiment of the present disclosure. The differencebetween the embodiment shown in FIG. 13 and the embodiment shown in FIG.12 is that the second region 302 of the conductive layer M is dividedinto four sections 302A, 302B, 302C and 302D which are separated apartfrom each other by three second gaps 312. In addition, the wire 110includes two in-wire gaps 310, and the first region 300 of theconductive layer M does not include the first gap.

Referring to FIG. 14, which is a top view of a test pad in accordancewith another embodiment of the present disclosure. The differencebetween the embodiment shown in FIG. 14 and the embodiments shown inFIGS. 9 and 11-13 is that the first region 300 of the conductive layer Mdoes not surround or enclose the second region 302 of the conductivelayer M. Instead, the first region 300 of the conductive layer M isdisposed at one side of the second region 302 of the conductive layer M.In addition, the second region 302 of the conductive layer M is dividedinto seven sections 302A, 302B, 302C, 302D, 302E, 302F and 302G whichare separated apart from each other by six second gaps 312. In otherembodiments, the shape of the second gap 312 is not limited to a linearshape, and the division manner is not limited to that shown in the aboveembodiments. Any division manner which may divide the second region 302of the conductive layer M into a plurality of the sections which areseparated apart from each other may be used in the present disclosure.

In summary, by electrically connecting the driving unit to thegate-driving circuit through the test pad, the present disclosure mayreduce the area occupied by the wire in the driving unit. Therefore, theproblem of insufficient area for the wire in the driving unit happenedas the resolution of the display panel is enhanced may be solved. Inaddition, the present disclosure utilizes the patterned test pad tolimit the corrosion happened after the testing step in a portion of thepatterned test pad, which in turn improves the reliability and yield ofthe display device.

The disclosure provides a display device that has a fanout area withcircuits that are integrated to a high degree in order to reduce thespace occupied by the fanout area. Therefore, the display device canhave a high resolution under the premise that the size of the displaydevice is fixed.

In addition, according to an embodiment of the disclosure, the displaydevice of the disclosure can further include a first conductive loop,having a plurality of conductive blocks, outside the display region, inorder to prevent the display device from damage caused by electrostaticdischarge during the process.

Moreover, according to an embodiment of the disclosure, the displaydevice of the disclosure can further include a second conductive loopoutside the display region, wherein a sealant is disposed over thesecond conductive loop and close to the peripheral boundary of thedisplay device, in order to achieve a high electrostatic dischargeability.

FIG. 15 shows a top-view of a display device according to an embodimentof the disclosure. The display device 100 includes a display region 104and a driving unit 106 disposed on a substrate 102. The display device100 can be a liquid-crystal display (such as thin film transistorliquid-crystal display), or an organic electroluminescent display (suchas active full-color organic electroluminescent display). The displayregion 104 has a plurality of pixels (not shown), and the driving unit106 is electrically connected to the display region 104 via a pluralityof signal line pairs 110, in order to provide input to the pixels of thedisplay region 110 so that the display device can display images. Inparticular, the display region 104 is separated from the driving unit106 by a fanout area 108, and a plurality of signal line pairs 110 aredisposed on the fanout area 108. At least one of the signal line pairs110 includes a first conductive line 112 and a second conductive line114, wherein the first conductive line 112 and the second conductiveline 114 are electrically isolated from each other. The first conductiveline 112 and the second conductive line 114 transmit different signals.For example, each of the pixels disposed in the display region 104 canhave at least three sub-pixels (such as red sub-pixel, blue sub-pixel,and green sub-pixel; or, red sub-pixel, blue sub-pixel, green sub-pixel,and white sub-pixel), and the various signals produced by the drivingunit 106 are transmitted to the sub-pixels via the first conductivelines 112 and second conductive lines 114. In addition, In the fanoutarea 108, at least a part of the first conductive line 112 overlaps withthe second conductive line 114.

As still shown in FIG. 15, the fanout area 108 can be defined as a firstcircuit area 108 a, a second circuit area 108 b, and a third circuitarea 108 c, wherein the first circuit area 108 a is adjacent to thedisplay region 104, the third circuit area 108 c is adjacent to thedriving unit 106, and the second circuit area 108 b area disposedbetween the first circuit area 108 a and third circuit area 108 c.

According to an embodiment of the disclosure, in the first circuit area108 a, any the first conductive line 112 and the adjacent secondconductive line 114 are separated by a distance (minimum horizontaldistance) Da. Namely, the first conductive block 112 and the secondconductive block 114 adjacent to the first conductive block 112 areseparated from each other. In the third circuit area 108 c, any thefirst conductive line 112 and the adjacent second conductive line 114are separated by a distance (minimum horizontal distance) Dc. Inparticular, the distance Da (the distance between the first conductiveblock 112 and the second conductive block 114 adjacent to the firstconductive block 112) can be from 3 to 40 μm, the distance Dc can befrom 3 μm to 18 μm, and the distance Da is longer than the distance Dc.

FIG. 16A shows a cross-sectional view of FIG. 15 along line A-A′. Asshown in FIG. 16A, in the second circuit area 108 b, the firstconductive line 112 and the second conductive line 114 of the samesignal line pair 110 can partially overlap each other. As a result, thehorizontal projection area of the first conductive line 112 and thesecond conductive line 114 can be reduced, and the integration degree ofthe fanout area 108 can be increased.

As shown in FIG. 16A, the first conductive line 112 can be disposed onthe substrate 102. A dielectric layer 116 can be disposed on thesubstrate 102 to cover the first conductive line 112. The secondconductive line 114 can be disposed on the dielectric layer 116, and thefirst conductive line 112 can overlap with the second conductive line114. A passivation layer 118 can be disposed on the dielectric layer 116to cover the second conductive line 114. In particular, the substrate102 can be quartz, glass, silicon, metal, plastic, or ceramic. Suitablematerials for the first conductive lines 112 and the second conductivelines 114 include a single-layer or multilayer metal conductive material(such as aluminum (Al), copper (Cu), molybdenum (Mo), titanium (Ti),platinum (Pt), iridium (Ir), nickel (Ni), chromium (Cr), silver (Ag),gold (Au), tungsten (W), or an alloy thereof), metal-containingconductive material (such as: aluminum-containing compound,copper-containing compound, molybdenum-containing compound,titanium-containing compound, platinum-containing compound,iridium-containing compound, nickel-containing compound,chromium-containing compound, silver-containing compound,gold-containing compound, tungsten-containing compound,magnesium-containing compound, or a combination thereof), or acombination thereof. Furthermore, the first conductive line 112 and thesecond conductive line 114 can be made of the same or differentmaterial. The dielectric layer 116 can be silicon nitride, siliconoxide, silicon oxynitride, silicon carbide, aluminum oxide, or acombination thereof. The passivation layer 118 can be made of organicinsulating materials (such as photosensitive resins) or inorganicinsulating materials (such as silicon nitride, silicon oxide, siliconoxynitride, silicon carbide, aluminum oxide, or a combination thereof),in order to isolate the first conductive line 112 and the secondconductive line 114 from air and moisture. In addition, according to anembodiment of the disclosure, the first conductive line 112 and thesecond conductive line 114 have tapered sidewalls, as shown in FIG. 16A.In particular, the tapered sidewall of the first conductive line 112 orthe second conductive line 114 has an inclination angle of 15 to 90°from horizontal. Further, the inclination angle of the first conductiveline 112 can be equal to or different from that of the second conductiveline 114.

According to an embodiment of the disclosure, the width W1 of the firstconductive line 112 can be from 2 to 10 μm, the width W2 of the secondconductive line 114 can be from 2 to 10 μm, and the width W1 can beequal to the width W2 (as shown in FIG. 16A). Further, the width W1 ofthe first conductive line 112 can be different from the width W2 of thesecond conductive line 114 (as shown in FIG. 16B). Namely, the ratio ofthe width W1 of the first conductive line 112 to the width W2 of thesecond conductive line 114 is from 1 to 5. For example, as shown in FIG.16B, the width W1 of the first conductive line 112 can be larger thanthe width W2 of the second conductive line 114. In addition, as shown inFIGS. 16A and 16B, the second conductive line 114 can completely overlapwith the first conductive line 112 (i.e., the horizontal projection ofthe second conductive line 114 can completely overlap the horizontalprojection of the first conductive line 112).

According to an embodiment of the disclosure, in the second circuit area108 b, any two adjacent first conductive lines 112 are separated by adistance D1 (i.e., the minimum horizontal distance between the twoadjacent first conductive lines 112 in the second circuit area 108 b).Further, in the second circuit area 108 b, any two adjacent secondconductive lines 114 are separated by a distance D2 (i.e., the minimumhorizontal distance between the two adjacent second conductive lines 114in the second circuit area 108 b). In particular, the distance D1 can befrom 2 to 30 μm, and the distance D2 can be from 2 to 30 μm.

According to an embodiment of the disclosure, in the second circuit area108 b, the sum (W1+D1) of the width W1 of the first conductive line 112and the distance D1 can be equal to the sum (W2+D2) of the width W2 ofthe second conductive line 114 and the distance D2. In addition, theratio (D1/(W1+D1)) of the distance D1 and the sum of the distance D1 andthe width W1 can be from 0.1 to 0.66. When the ratio (D1/(W1+D1)) isgreater than or equal to 0.1, a sealant (not shown) subsequently formedwithin the second circuit area 108 b is apt to be completely cured aftera curing process (irradiating an energy from the substrate 102 side). Onthe other hand, when the ratio (D1/(W1+D1)) is less than or equal to0.66, the integration degree of conductive lines of the second circuitarea 108 b can be increased.

According to embodiments of the disclosure, the overlapping portion ofthe first conductive line 112 and the second conductive line 114 (i.e.,the overlapping portion of the horizontal projection of the firstconductive line 112 and the horizontal projection of the secondconductive line 114) has a width W3 (i.e., the minimum horizontalwidth). Further, the ratio (W3/W1) of the width W3 and the width W1 ofthe first conductive line 112 is from 0.3 to 1.

With respect to the signal line pair 110 in the second circuit area 108b, at least a part of the first conductive line 112 can overlap with thesecond conductive line 114 (i.e., at least a part of the horizontalprojection of the first conductive line 112 can overlap the horizontalprojection of the second conductive line 114), as shown in FIG. 16C.Herein, the relationship between the width W1 of the first conductiveline 112, the width W2 of the second conductive line 114, and the widthW3 can be defined by the following equation:(W1+W2−W3)/W1≧1

FIG. 17 is a top-view of a display device 100 according to an embodimentof the disclosure. Besides the display region 104, the driving unit 106,and the fanout area 108, the display device 100 further includes a firstconductive loop 117 disposed outside the display region 104. As shown inFIG. 17, the first conductive loop 117 can be disposed on the substrate102 and surround the display region 104. Further, the first conductiveloop 117 can be electrically connected to the driving unit 106, and thedriving unit 106 can provide a voltage signal to the first conductiveloop 117 in order to force the first conductive loop 117 to generate areference voltage. Since the first conductive loop 117 would overlapwith the signal line pairs 110 in the fanout area 108, anotherconducting layer can be used as a substitute for the first conductiveloop 117 or the signal line pairs 110 in order to avoid contact betweenthe first conductive loop 117 and the signal line pairs 110.

According to an embodiment of the disclosure, at least a part of thefirst conductive loop 117 includes a plurality of first conductiveblocks 202 and a plurality of second conductive blocks 204. The firstconductive blocks 202 and the second conductive blocks 204 areelectrically connected to each other. FIG. 18A shows a cross-sectionalview of the display device 100 of FIG. 17 along line B-B′. According toan embodiment of the disclosure, the part of the first conductive loop117 including the plurality of first conductive blocks 202 and theplurality of second conductive blocks 204 can be disposed on the twoopposite sides of the display region 104, and the part of the firstconductive loop 117 can be perpendicular to a first axis X (i.e.parallel to a second axis Y). In an embodiment of the disclosure, sincethere are a plurality of data lines (not shown) disposed on the twoopposite sides of the display region 104 corresponding to the first axisX (i.e. the plurality of data lines perpendicular to the first axis X),the part of the first conductive loop 117 including the plurality offirst conductive blocks 202 and the plurality of second conductiveblocks 204 is not apt to be disposed parallel to the first axis X. Insome embodiments of the disclosure, the part of the first conductiveloop 117 including the plurality of first conductive block 202 and theplurality of second conductive block 204 can be also disposed on the twoopposite sides of the display region 104 and parallel to a first axis X.

As shown in FIG. 18A, the plurality of first conductive blocks 202 canbe disposed on the substrate 102. A dielectric layer 206 can be disposedon the substrate 102 to cover the first conductive blocks 202. Theplurality of second conductive blocks 204 can be disposed on thedielectric layer 206. A passivation layer 208 can be disposed on thedielectric layer 206 to cover the second conductive blocks 204. Inaddition, a plurality of first via holes 205 pass through the dielectriclayer 206 and the passivation layer 208, exposing the first conductiveblock 202. A plurality of second via holes 207 pass through thepassivation layer 208, exposing the second conductive block 204. Aconducting layer 210 can be disposed on the passivation layer 208 tofill into the first via hole 205 and the second via hole 207, resultingin the plurality of first conductive blocks 202 and the plurality ofsecond conductive blocks 204 being electrically connected to each othervia the conducting layer 210.

According to an embodiment of the disclosure, the first conductive block202 and the second conductive block 204 can be a made of single-layer ormultilayer metal conductive material (such as aluminum (Al), copper(Cu), molybdenum (Mo), titanium (Ti), platinum (Pt), iridium (Ir),nickel (Ni), chromium (Cr), silver (Ag), gold (Au), tungsten (W), or analloy thereof), metal-containing conductive material (such as:aluminum-containing compound, copper-containing compound,molybdenum-containing compound, titanium-containing compound,platinum-containing compound, iridium-containing compound,nickel-containing compound, chromium-containing compound,silver-containing compound, gold-containing compound,tungsten-containing compound, magnesium-containing compound, or acombination thereof), or a combination thereof. Further, the materialsof first conductive blocks 202 and second conductive blocks 204 can bethe same or different. According to an embodiment of the disclosure, thefirst conductive blocks 202 and the first conductive line 112 can beformed in the same process and made of the same material; and/or, thesecond conductive blocks 204 and the second conductive line 114 can beformed in the same process and made of the same material. The dielectriclayer 206 can be silicon nitride, silicon oxide, silicon oxynitride,silicon carbide, aluminum oxide, or a combination thereof. Further, thedielectric layer 206 and the dielectric layer 116 can be formed in thesame process and made of the same material. The passivation layer 208can be organic insulating materials (such as photosensitive resins) orinorganic insulating materials (such as silicon nitride, silicon oxide,silicon oxynitride, silicon carbide, aluminum oxide, or a combinationthereof). The passivation layer 208 and the passivation layer 118 can beformed in the same process and made of the same material. In addition,the conducting layer 210 can be a single-layer or multilayer transparentconducting layer, and the material of the conducting layer 210 can beITO (indium tin oxide), IZO (indium zinc oxide), AZO (aluminum zincoxide), ZnO (zinc oxide), tin oxide, indium oxide, or a combinationthereof.

As still shown in FIG. 18A, in order to prevent the display device 100from damage caused by electrostatic discharge during the fabrication ofthe display device, the first conductive block 202 can have a length L1between 10 and 10000 μm, and the second conductive block 204 can have alength L2 between 10 and 10000 μm. In addition, any two adjacent firstconductive blocks 202 are separated by a distance D3, any two adjacentsecond conductive blocks 204 are separated by a distance D4, and any twoadjacent first and second conductive blocks 202 and 204 are separated bya distance D5. In particular, the distance D3 is from 16 to 100 μm, thedistance D4 is from 16 to 100 μm, and the distance D5 is from 3 to 40μm.

According to another embodiment of the disclosure, any two adjacentfirst conductive blocks 202 can be electrically connected to each othervia the second conductive block 204 adjacent to the two adjacent firstconductive blocks 202. As shown in FIG. 18B, the plurality of firstconductive blocks 202 can be disposed on the substrate 102. Thedielectric layer 206 can be disposed on the substrate 102 to cover thefirst conductive block 202. A plurality of third via holes 209 passthrough the dielectric layer 206 exposing the first conductive block202. The plurality of second conductive blocks 204 can be disposed onthe dielectric layer 206 to fill into the third via hole 209, forcingthe second conductive block 204 to overlap with the two first conductiveblock 202 adjacent to the second conductive block 204. Therefore, thefirst conductive blocks 202 and the second conductive blocks 204 can beelectrically connected to each other in the absence of the conductinglayer 210.

According to other embodiments of the disclosure, as shown in FIG. 18C,a planarization layer 212 can be further formed on the passivation layer208. A plurality of fourth via holes 211 pass through the dielectriclayer 206, the passivation layer 208, and the planarization layer 212,exposing the first conductive blocks 202. A plurality of fifth via holes213 pass through the passivation layer 208 and the planarization layer212, exposing the second conductive blocks 204. The conducting layer 210can be formed on the planarization layer 212 to be filled into thefourth via hole 211 and the fifth via hole 213, resulting in the firstconductive blocks 202 and the second conductive blocks 204 beingelectrically connected to each other via the conducting layer 210. Inparticular, the planarization layer 212 can be a layer with insulatingproperties, such as a dielectric material, or photosensitive resin.

FIG. 19 shows a top view of the display device 100 according to anembodiment of the disclosure. In addition to the display region 104, thedriving unit 106, the fanout area 108, and the first conductive loop117, the display device 100 can further include a second conductive loop119. The second conductive loop 119 can be disposed on substrate 102outside the display region 104 and the first conductive loop 117. Asshown in FIG. 19, the second conductive loop 119 can be disposed on thesubstrate 102 to surround the display region 104 and connect to thedriving unit 106. The second conductive loop 119 can serve as anelectrostatic discharge (ESD) protection element, preventing the pixelswithin the display region 104 from damage caused by electrostaticdischarge. In addition, a sealant 120 can be disposed on the substrate102 to cover a part of the second conductive loop 119. In particular, aregion defined by projecting the sealant 120 to the substrate 102 servesas a package region (not shown). The second conductive loop 119 withinthe package region is completely covered by the sealant 120.

The second conductive loop 119 can be single-layer or multilayer metalconductive material (such as aluminum (Al), copper (Cu), molybdenum(Mo), titanium (Ti), platinum (Pt), iridium (Ir), nickel (Ni), chromium(Cr), silver (Ag), gold (Au), tungsten (W), or an alloy thereof),metal-containing conductive material (such as aluminum-containingcompound, copper-containing compound, molybdenum-containing compound,titanium-containing compound, platinum-containing compound,iridium-containing compound, nickel-containing compound,chromium-containing compound, silver-containing compound,gold-containing compound, tungsten-containing compound,magnesium-containing compound, or a combination thereof), or acombination thereof. According to an embodiment of the disclosure, thesecond conductive loop 119 can be formed simultaneously during theprocess for forming the first conductive blocks 202 and the secondconductive blocks 204. In addition, the sealant can be a resin.

As shown in FIG. 19, the display device 100 has a peripheral boundary122. In the package region, there is no distance between the sealant 120and the peripheral boundary 122 (the horizontal distance between thesealant 120 and the peripheral boundary 122 is 0). FIG. 20 is across-sectional view of the display device 100 as shown in FIG. 19 alongline C-C′. As shown in FIG. 20, the second conductive loop 119 and theperipheral boundary 122 are separated by a distance D6, and the sealant120 is disposed on the second conductive loop 119 within the peripheralboundary 122. Namely, the space between the second conductive loop 119and the peripheral boundary 122 is filled with the sealant 120. Itshould be noted that the distance D6 is from 50 to 300 μm in order toprevent the second conductive loop 119 from erosion and corrosion bymoisture and air and achieve the electrostatic discharge (ESD)protection ability of the second conductive loop 119.

In order to ensure that the second conductive loop 119 is not beuncovered by the sealant 120 due to a processing error, a so-called“cutting-on-sealant process” is employed during the processes forfabricating the display device of the disclosure. FIG. 21 shows aschematic top view of a display device main substrate 201 according toan embodiment of the disclosure. The display device as shown in FIG. 19can be obtained after cutting the display device main substrate 201 viaa cutting process. As shown in FIG. 21, when forming the sealant 120 onthe substrate 102, the sealant 120 is formed to cover the predeterminedcutting line 124. Therefore, after performing the cutting process (usingfor example, a single-tool cutting process, a multi-tool cuttingprocess, or a laser cutting process) along the predetermined cuttingline 124, there is no distance between the peripheral boundary 122 andthe sealant 120 of the obtained display device 100 (such as the displaydevice 100 as shown in FIG. 19). Further, the second conductive loop 119is separated from the peripheral boundary 122 by the distance D6. Asshown in FIG. 21, the sealant 120 can be formed to contact theperipheral boundary 122.

In addition, according to an embodiment of the disclosure, when formingthe sealant 120 on the substrate 102, the sealant 120 can cover thepredetermined cutting line 124 and not contact the peripheral boundary122, as shown in FIG. 22. After performing the cutting process along thepredetermined cutting line 124, the display device 100 as shown in FIG.19 can be still obtained.

Accordingly, the area occupied by the fanout area of the display deviceof the disclosure can be lowered resulting from increasing theconductive line integration degree in the fanout area. Therefore, thedisplay device can have a larger display region under the premise thatthe size of the display device is fixed. In addition, the display deviceof the disclosure can further include a first conductive loop outsidethe display region, wherein the first conductive loop includes aplurality of conductive blocks. Therefore, the first conductive loop canprevent the display device from damage caused by electrostatic dischargeduring the fabrication of the display device. Moreover, the displaydevice of the disclosure can further include a second conductive loopoutside the display region, wherein a sealant is disposed on the secondconductive loop and within the peripheral boundary of the displaydevice, in order to achieve high electrostatic discharge ability of thesecond conductive loop.

The embodiments of the present disclosure utilize a spacer wall disposedbetween the pixel-displaying region and the sealant to prevent thesealant from contacting the liquid-crystal material in thepixel-displaying region. Therefore, the distance between the sealant andthe pixel-displaying region may be further reduced to narrow thenon-display region of the display devices.

First, referring to FIGS. 1A and 1B. FIG. 23A is a top view of a displaydevice in accordance with some embodiments of the present disclosure,and FIG. 23B is a cross-sectional view along line 1B-1B in FIG. 23A inaccordance with some embodiments of the present disclosure. As shown inFIG. 23A, the display device 100 includes a first substrate 101 and asecond substrate 103 disposed opposite to the first substrate 101. Inaddition, as shown in FIGS. 1A and 1B, the display device 100 includes apixel-displaying region 104 and a non-display region 105 adjacent to thepixel-displaying region 104. In other words, the first substrate 101 andthe second substrate 103 may both be divided into a pixel-displayingregion 104 and a non-display region 105 adjacent to the pixel-displayingregion 104. In addition, the non-display region 105 may include an outlead bonding (OLB) region 115, as shown in FIG. 23A.

The display device 100 may include, but is not limited to, aliquid-crystal display such as a thin film transistor liquid-crystaldisplay. Alternatively, the liquid-crystal display may include, but isnot limited to, a twisted nematic (TN) liquid-crystal display, a supertwisted nematic (STN) liquid-crystal display, a double layer supertwisted nematic (DSTN) liquid-crystal display, a vertical alignment (VA)liquid-crystal display, an in-plane switching (IPS) liquid-crystaldisplay, a cholesteric liquid-crystal display, a blue phaseliquid-crystal display, or any other suitable liquid-crystal display.

Referring to FIG. 23B, the first substrate 101 includes a firsttransparent substrate 126, a light-shielding layer 128 disposed over thefirst transparent substrate 126 and a color filter layer 130 disposedover the light-shielding layer 128. In addition, the first substrate 101may further include a planar layer 132 covering the color filter layer130 and a portion of the light-shielding layer 128.

The first transparent substrate 126 may include, but is not limited to,a glass substrate, a ceramic substrate, a plastic substrate, or anyother suitable transparent substrate. The light-shielding layer 128 isused to shield the non-display region 105 and the elements in thepixel-displaying region 104 other than the pixels. The light-shieldinglayer 128 may include, but is not limited to, black photoresist, blackprinting ink, black resin or any other suitable light-shieldingmaterials of various colors. The color filter layer 130 may includecolor filter layers 130A, 130B and 130C disposed in the pixel-displayingregion 104 and a color filter layer 130D disposed in the non-displayregion 105. Each of the color filter layers 130A, 130B and 130C mayindependently include a red color filter layer, a green color filterlayer, a blue color filter layer, or any other suitable color filterlayer. The material of the planar layer 132 may include, but is notlimited to, organic silicon oxides photoresist, or inorganic materialssuch as silicon nitride, silicon oxide, silicon oxynitride (SiON),silicon carbide, aluminum oxide, hafnium oxide, or a multi-layeredstructure of the above materials.

Still referring to FIG. 23B, the second substrate 103 includes a secondtransparent substrate 134. The material of the second transparentsubstrate 134 may include the aforementioned material of the firsttransparent substrate 126. The material of the first transparentsubstrate 126 may be the same as or different from that of the secondtransparent substrate 134. In addition, a transistor such as a thin filmtransistor (not shown) is disposed in or over the second transparentsubstrate 134. This transistor is used to control the pixels. The secondsubstrate 103 may further include an insulating layer 136 which coversthe second transparent substrate 134 and the transistor. The insulatinglayer 136 is used to electrically isolate the second substrate 103 fromthe elements disposed between the first substrate 101 and the secondsubstrate 103. The material of the insulating layer 136 may include, butis not limited to, silicon oxide, silicon nitride, silicon oxynitride, acombination thereof, or any other suitable material.

Still referring to FIGS. 1A and 1B, the display device 100 furtherincludes a sealant 120 and liquid-crystal material 138 disposed betweenthe first substrate 101 and the second substrate 103. The sealant 120 isused to seal the liquid-crystal material 138 between the first substrate101 and the second substrate 103. The material of the sealant 120 mayinclude, but is not limited to, insulating transparent resin or anyother suitable sealant material. The material of the liquid-crystalmaterial 138 may include, but is not limited to, nematic liquid crystal,smectic liquid crystal, cholesteric liquid crystal, blue phase liquidcrystal, or any other suitable liquid-crystal material.

As shown in FIGS. 1A and 1B, the sealant 120 is disposed outside thepixel-displaying region 104. In other words, the sealant 120 is disposedin the non-display region 105. In some embodiments, the sealant 120 maysurround or enclose the pixel-displaying region 104. In addition, thewidth W4 of the sealant 120 ranges from about 200 μm to 900 μm, forexample from about 500 μm to 800 μm. It should be noted that, if thewidth W4 of the sealant 120 is too great, for example greater than 900μm, the non-display region 105 of the display device 100 would be toowide, which in turn hinders the display device 100 from being thinner,lighter, smaller and more fashionable than the last. However, if thewidth W4 of the sealant 120 is too small, for example smaller than 200μm, portions of the sealant 120 may break and it will not effectivelyseal the liquid-crystal material 138.

Still referring to FIGS. 1A and 1B, the display device 100 furtherincludes a spacer wall 140 disposed between the first substrate 101 andthe second substrate 103. The spacer wall 140 is also disposed betweenthe pixel-displaying region 104 and the sealant 120 to further preventthe sealant 120 from contacting the liquid-crystal material 138 in thepixel-displaying region 104. In addition, the spacer wall 140 has afirst side S1 which is adjacent to the pixel-displaying region 104 and asecond side S2 which is adjacent to the sealant 120. The height H1 ofthe first side S1 is greater than the height H2 of the second side S2.For example, as shown in the figure, the height of the spacer wall 140gradually decreases from H1 at side S1 (side adjacent to thepixel-displaying region 104) to H2 at side S2 (side adjacent to thesealant 120). It should be noted that, although the spacer wall 140 isdisposed over the planar layer 132 of the first substrate 101 in theembodiment shown in FIGS. 1A and 1B, the spacer wall 140 may disposedover the second substrate 103 in other embodiments. This will bedescribed in detail in the following description. In addition, althoughthe spacer wall 140 completely surrounds or encloses thepixel-displaying region 104 in the embodiment shown in FIG. 23A, thoseskilled in the art will appreciate that the display device 100 mayinclude not only one spacer wall 140 but also a plurality of spacerwalls. In addition, the spacer wall 140 may partially surround orenclose the pixel-displaying region 104. Therefore, the inventiveconcept may be embodied in various forms without being limited to theexemplary embodiments as shown in FIG. 23A.

In addition, the material of the spacer wall 140 may include, but is notlimited to, a resist such as a positive resist or a negative resist. Thespacer wall 140 may be formed by photolithography and etching steps. Inone embodiment, the photolithography steps may include resistpatterning. The resist patterning may include steps such as resistcoating, soft baking, mask alignment, pattern exposure, post-exposurebaking, resist developing and hard baking. The etching step may includereactive ion etch (RIE), plasma etch, or any other suitable etchingstep.

Referring to FIG. 23B, the spacer wall 140 (or the first alignment layer148 subsequently disposed over the top surface of the spacer wall 140)does not directly contact the second substrate 103. Therefore, thedisplay device 100 includes a first gap G1 between the spacer wall 140(or the first alignment layer 148 subsequently disposed over the topsurface of the spacer wall 140) and the second substrate 103. The heightH5 of the first gap G1 may range from about 0.1 μm to 1.5 μm, forexample from about 0.3 μm to 0.8 μm. The height H5 of the first gap G1refers to the average value of the maximum distance H6 and the minimumdistance H7 calculated from the second alignment layer 150 to the topsurface of the spacer wall 140 (or the first alignment layer 148subsequently disposed over the top surface of the spacer wall 140). Inother words, H5=(H6+H7)/2. In addition, the sealant 120 may directlycontact the spacer wall 140, and portions of the sealant 120 may furtherextend from the second side S2 to the first side S1 by a distance D8.The distance D8 may range from about 20% to 90% of the width W5 of thespacer wall 140, for example from about 40%-70%. It should be notedthat, if the distance D8 is too great, for example greater than 90% ofthe width W5 of the spacer wall 140, the sealant 120 may contact andcontaminate the liquid-crystal material 138 in the pixel-displayingregion 104, which in turn increases the risk of defects and lowers theyield. In addition, if the height H5 of the first gap G1 is too large,for example larger than 1.5 μm, the spacer wall 140 cannot effectivelyprevent the sealant 120 from extending into the pixel-displaying region104 through the first gap G1, and the height difference between thespacer wall 140 and the main spacer 142 is too large, the sealant 120may contact and contaminate the liquid-crystal material 138 in thepixel-displaying region 104, which in turn results in mura such as framemura in the display device 100. However, if the height H5 of the firstgap G1 is too small, for example smaller than 0.1 μm, the top surface ofthe spacer wall 140 would be too close to the second substrate 103 suchthat the sealant 120 extending into the first gap G1 may push the secondsubstrate 103 away from the first substrate 101, which in turn resultsin mura such as gap mura in the display device 100 and lower the yield.

Since the spacer wall 140 may prevent the sealant 120 from contactingthe liquid-crystal material 138 in the pixel-displaying region 104, thedistance between the sealant 120 and the pixel-displaying region 104 maybe further reduced to narrow the non-display region 105 of the displaydevice 100 and make the display device 100 thinner, lighter, smaller andmore fashionable than the last. In addition, since the height H1 of thefirst side S1 of the spacer wall 140 is greater than the height H2 ofthe second side S2, even though the sealant 120 extends into the firstgap G1 between the spacer wall 140 and the second substrate 103, thehigher height H1 of the first side S1 may prevent the sealant 120 fromextending into the pixel-displaying region 104 through the first gap G1and thus prevent the sealant 120 from contacting the liquid-crystalmaterial 138 in the pixel-displaying region 104 and resulting in defectsin the display device 100. As shown in FIG. 1B, without considering theportion of the sealant 120 extending into the first gap G1, the distancebetween the sealant 120 and the pixel-displaying region 104 is the totaldistance of the width W5 of the spacer wall 140, the thickness T1 of thefirst alignment layer 148 disposed over the two sides S1 and S2 of thespacer wall 140 and the distance D7 between the first side S1 of thespacer wall 140 and the pixel-displaying region 104. In other words, thedistance between the sealant 120 and the pixel-displaying region 104 isW5+2×T1+D7.

The height difference between the height H1 of the first side S1 of thespacer wall 140 and the height H2 of the second side S2 may range fromabout 0.01 μm to 0.3 μm, for example from about 0.05 μm to 0.1 μm. Itshould be noted that, if the height difference between the first side S1and the second side S2 is too great, for example greater than 0.3 μm,the height H2 of the second side S2 would be too low and the spacer wall140 cannot effectively prevent the sealant 120 from contacting theliquid-crystal material 138 in the pixel-displaying region 104. However,if the height difference is too small, for example smaller than 0.01 μm,the spacer wall 140 cannot utilize the height difference between thefirst side S1 and the second side S2 to prevent the sealant 120 fromextending into the pixel-displaying region 104 through the first gap G1

Still referring to FIG. 23B, the width W5 of the spacer wall 140 mayrange from about 10 μm to 200 μm, for example from about 60 μm to 110μm. It should be noted that, if the width W5 of the spacer wall 140 istoo large, for example larger than 200 μm, the non-display region 105 ofthe display device 100 would be too broad, which in turn hinders thedisplay device 100 from being thinner, lighter, smaller and morefashionable than the last. However, if the width W5 of the spacer wall140 is too small, for example smaller than 10 μm, the spacer wall 140cannot effectively prevent the sealant 120 from contacting theliquid-crystal material 138 in the pixel-displaying region 104.

In addition, the distance D7 between the first side S1 of the spacerwall 140 and the pixel-displaying region 104 may range from about 20 μmto 200 μm, for example from about 50 μm to 100 μm. It should be notedthat, if the distance D7 is too large, for example larger than 200 μm,the non-display region 105 of the display device 100 would be too broad,which in turn hinders the display device 100 from being thinner,lighter, smaller and more fashionable than the last. However, if thedistance D7 is too small, for example smaller than 20 μm, the sealant120 may contact the liquid-crystal material 138 in the pixel-displayingregion 104, which in turn increase the risk of defects and lower theyield.

In addition, the height H3 of the spacer wall 140 may be adjusted byaltering the distance D7 between the first side S1 of the spacer wall140 and the pixel-displaying region 104. In particular, the lower thedistance D7, the lower the reflow effect of the spacer wall 140 and thespacer wall 140 may have a greater height. On the other hand, thegreater the distance D7, the greater the reflow effect of the spacerwall 140 and the spacer wall 140 may have a lower height. Therefore, byaltering the distance D7, the height difference between the main spacer142 and the spacer wall 140 (namely H4-H3) may be adjusted to fall inthe preferable range mentioned below (namely about 0.1 μm to 1.5 μm).

Still referring to FIG. 23B, the display device 100 further includes amain spacer 142 disposed between the first substrate 101 and secondsubstrate 103. The main spacer 142 is disposed inside thepixel-displaying region 104. The main spacer 142 and the spacer wall 140may be formed by the same photolithography and etching steps. However,the main spacer 142 may be formed by other photolithography and etchingsteps.

In addition, the height H4 of the main spacer 142 is greater than theheight H3 of the spacer wall 140. The height H3 of the spacer wall 140refers to the average value of the height H1 of the first side S1 of thespacer wall 140 and the height H2 of the second side S2 of the spacerwall 140. In other words, H3=(H1+H2)/2. In some embodiments, the heightH4 of the main spacer 142 is greater than the height H3 of the spacerwall 140 by a height difference ranging from about 0.1 μm to 1.5 μm, forexample from about 0.3 μm to 0.8 μm. It should be noted that, if theheight difference between the main spacer 142 and the spacer wall 140 istoo large, for example larger than 1.5 μm, mura such as frame mura wouldbe resulted in the display device 100. However, if the height differencebetween the main spacer 142 and the spacer wall 140 is too small, forexample smaller than 0.1 μm, the top surface of the spacer wall 140would be too close to the second substrate 103 such that the sealant 120extending into the first gap G1 may push the second substrate 103 awayfrom the first substrate 101, which in turn results in mura such as gapmura in the display device 100 and lower the yield.

Referring back to FIG. 23A, the spacer wall 140 includes a corner region144 and a longitudinal region 146. The width W6 of the corner region 144is different from the width W7 of the longitudinal region 146. Forexample, in the embodiment shown in FIG. 23A, the width W6 of the cornerregion 144 is greater than the width W7 of the longitudinal region 146.

However, the width of the corner region may be smaller than the width ofthe longitudinal region. Referring to FIG. 24, which is a top view of adisplay device in accordance with another embodiment of the presentdisclosure. The difference between the embodiment shown in FIG. 24 andthe embodiment shown in FIG. 23A is that the width W6 of the cornerregion 144 is smaller than the width W7 of the longitudinal region 146.In addition, those skilled in the art will appreciate that the width ofthe corner region may be the same as the width of the longitudinalregion. Therefore, the exemplary embodiments put forth in FIGS. 23A, 23Band 24 are merely for the purpose of illustration, and the inventiveconcept may be embodied in various forms without being limited to theexemplary embodiments as shown in FIGS. 23A, 23B and 24. Note that thesame or similar elements or layers corresponding to those of the displaydevice are denoted by like reference numerals. The same or similarelements or layers denoted by like reference numerals have the same orsimilar materials, manufacturing processes and functions. These will notbe repeated for the sake of brevity.

Referring back to FIG. 23B, the display device 100 may further include afirst alignment layer 148 disposed over the planar layer 132 andcovering the spacer wall 140 and the main spacer 142. The display device100 may further include a second alignment layer 150 disposed over theinsulating layer 136. The first alignment layer 148 and the secondalignment layer 150 are layers used to induce the liquid-crystalmolecules to align with specific direction. The materials of each of thefirst alignment layer 148 and second alignment layer 150 mayindependently include, but are not limited to, polyimide, or any othersuitable alignment material. In addition, the first alignment layer 148disposed over the top surface of the main spacer 142 may directlycontact the second alignment layer 150. The thickness of the firstalignment layer 148 may range from about 300 Å to 1000 Å, for examplefrom about 400 Å to 700 Å. The thickness T1 of the first alignment layer148 over the planar layer 132 is greater than or equal to the thicknessT2 of the first alignment layer 148 over the spacer wall 140.

Still referring to FIG. 23B, as mentioned above, the color filter layer130 of the first substrate 101 may include the first color filter layer130D disposed in the non-display region 105. The first color filterlayer 130D is disposed under the spacer wall 140 and corresponds to thespacer wall 140. In addition, as shown in FIG. 23B, the width W8 of thefirst color filter layer 130D is greater than the width W5 of the spacerwall 140. However, it should be noted that the width of the first colorfilter layer may also be smaller than the width of the spacer wall. Forexample, in the embodiment shown in FIG. 25, the width W8 of the firstcolor filter layer 130D is smaller than the width W5 of the spacer wall140. In addition, those skilled in the art will appreciate that thewidth of the first color filter layer may equal to the width of thespacer wall. Therefore, the exemplary embodiments set forth in FIGS.23A, 23B, 24 and 25 are merely for the purpose of illustration, and theinventive concept may be embodied in various forms without being limitedto the exemplary embodiments as shown in FIGS. 23A, 23B, 24 and 25.

The height H3 of the spacer wall 140 may be adjusted by altering thewidth W8 of the first color filter layer 130D which is disposed underthe spacer wall 140 and corresponds to the spacer wall 140. Inparticular, the smaller the width W8 of the first color filter layer130D, the greater the reflow effect of the spacer wall 140 and thespacer wall 140 may have a lower height. On the other hand, the largerthe width W8 of the first color filter layer 130D, the lower the refloweffect of the spacer wall 140 and the spacer wall 140 may have a greaterheight. Therefore, by altering the width W8 of the first color filterlayer 130D, the height difference between the main spacer 142 and thespacer wall 140 (namely H4-H3) may be adjusted to fall in the preferredrange mentioned above (namely about 0.1 μm to 1.5 μm).

In addition, referring to FIG. 26, which is a cross-sectional view of adisplay device in accordance with another embodiment of the presentdisclosure. The difference between the embodiment shown in FIG. 26 andthe embodiments shown in FIGS. 1A-3 is that the color filter layer 130of the first substrate 101 further includes a second color filter layer130E which is disposed under the spacer wall 140 and corresponds to thespacer wall 140. The second color filter layer 130E is different fromthe first color filter layer 130D. The boundary S3 between the firstcolor filter layer 130D and second color filter layer 130E is disposedunder the spacer wall 140 and corresponds to the spacer wall 140.However, it should be noted that the boundary S3 between the first colorfilter layer 130D and second color filter layer 130E may also correspondto the first side S1 of the spacer wall 140 or the region outside thefirst side S1. Therefore, the exemplary embodiment set forth in FIG. 26is merely for the purpose of illustration, the inventive concept may beembodied in various forms without being limited to the exemplaryembodiments as shown in FIG. 26. In addition, similar to the first colorfilter layer 130D, the height H3 of the spacer wall 140 may be adjustedby altering the width W9 of the second color filter layer 130E which isdisposed under the spacer wall 140 and corresponds to the spacer wall140.

FIG. 27 is a cross-sectional view of a display device in accordance withanother embodiment of the present disclosure. The difference between theembodiment shown in FIG. 27 and the embodiments shown in FIGS. 23A-26 isthat the spacer wall 140 is disposed over the insulating layer 136 ofthe second substrate 103, rather than being disposed over the planarlayer 132 of the first substrate 101, as in the embodiments shown inFIGS. 23A-26. In addition, as shown in FIG. 27, the display device 100may further include the second alignment layer 150 disposed over theinsulating layer 136 and covering the spacer wall 140. The material ofthe second alignment layer 150 may be the same as the material of thefirst alignment layer 148. In addition, the second alignment layer 150disposed over the top surface of the main spacer 142 may directlycontact the first alignment layer 148. The thickness T3 of the secondalignment layer 150 over the insulating layer 136 is greater than orequal to the thickness T4 of the second alignment layer 150 over thespacer wall 140.

In addition, the spacer wall 140 (or the second alignment layer 150disposed over the top surface of the spacer wall 140) does not directlycontact the first substrate 101. Therefore, the display device 100includes a second gap G2 between the spacer wall 140 (or the secondalignment layer 150 disposed over the top surface of the spacer wall140) and the first substrate 101. The height H8 of the second gap G2 mayrange from about 0.1 μm to 1.5 μm, for example from about 0.3 μm to 0.8μm. The height H8 of the second gap G2 refers to the average value ofthe maximum distance H9 and the minimum distance H10 calculated from thefirst alignment layer 148 to the top surface of the spacer wall 140 (orthe second alignment layer 150 disposed over the top surface of thespacer wall 140). In other words, H8=(H9+H10)/2. It should be notedthat, if the height H8 of the second gap G2 is too large, for examplelarger than 1.5 μm, the spacer wall 140 cannot effectively prevent thesealant 120 from extending into the pixel-displaying region 104 throughthe second gap G2, and the height difference between the spacer wall 140and the main spacer 142 is too large, mura such as frame mura in thedisplay device 100 would result. However, if the height H8 of the secondgap G2 is too small, for example smaller than 0.1 μm, the top surface ofthe spacer wall 140 would be too close to the first substrate 101 suchthat the sealant 120 extending into the second gap G2 may push the firstsubstrate 101 away from the second substrate 103, which in turn resultsin mura such as gap mura in the display device 100 and lower the yield.

In summary, since the spacer wall of the present disclosure may preventthe sealant from contacting the liquid-crystal material in thepixel-displaying region, the distance between the sealant and thepixel-displaying region may be reduced further to narrow the non-displayregion of the display devices and display device may be thinner,lighter, smaller and more fashionable than the last. In addition, sincethe side of the spacer wall adjacent to the pixel-displaying region hasa greater height, even though the sealant extends into the gap, thesealant cannot extends into the pixel-displaying region, which in turnmay further prevent the sealant from contacting the liquid-crystalmaterial and resulting in defects in the display device.

According to embodiments of the disclosure, the display device hasspacers disposed on the stable cutting region for increasing structuralstability during a cutting process. Therefore, side walls of thesubstrates of the display device have specific cutting crack surfaces,resulting in improving the cutting and breaking performance and reducingthe substrate breakage rate. As a result, the yield of the displaydevice can be improved.

In addition, according to embodiments of the disclosure, the displaydevice of the disclosure can further include a test circuit disposedalong predetermined cutting lines. Therefore, after the cutting process,the test circuit can be used to detect whether cutting shift isoccurring on the display device.

FIG. 28 is a top-view of a display device according to an embodiment ofthe disclosure. The display device 100 includes a first substrate 101and a second substrate 103, wherein the first substrate 101 is disposedopposite to the second substrate 103, and the first substrate 101 andthe second substrate 103 are bonded together via a sealant 120. Thefirst substrate 101 has a display region 104. The second substrate 103has a stable cutting region 160, and the stable cutting region 160corresponds to an area outside the display region 104 of the firstsubstrate 101. Furthermore, the stable cutting region 160 is adjacent tothe peripheral boundary 122 (including a first boundary 122A, a secondboundary 122B, and a third boundary 122C) of the first substrate 101, onwhich a projection of the second substrate 103 is located. In addition,there is a substrate border 123 between the part of the first substrate101 overlapped by the second substrate 103 and the part of the firstsubstrate 101 not overlapped by the second substrate 103. The sealant120 is disposed along the first boundary 122A, the second boundary 122B,the third boundary 122C, and the substrate border 123. Furthermore, thesealant 120 is disposed outside the display region 104.

The display device 100 can be a liquid-crystal display (such as a thinfilm transistor liquid-crystal display), or an organic light emittingdevice (such as an active organic light emitting device). The displayregion 104 can have a plurality of pixels (not shown). The firstsubstrate 101 and the second substrate 103 can be quartz, glass,silicon, metal, plastic, or ceramic. Furthermore, the sealant 120 can bea resin.

According to an embodiment of the disclosure, there are a plurality ofspacers 161 disposed within the stable cutting region 160. The sealant120 can overlap a part of the spacers 161. For example, the sealant 120overlaps five spacers 161, and others (five other spacers 161) areoutside the sealant 120. In an embodiment of the disclosure, the sealantcan cover all the spacers 161. For example, ten spacers are covered bythe sealant. In other embodiments of the disclosure, at least part ofthe spacers are overlapped by the sealant and are adjacent to aliquid-crystal layer. For example, the sealant 120 overlaps five spacers161, and each of the others is partially outside the sealant 120. Thestable cutting region 160 can include a first stable region 160A, asecond stable region 160B, and a third stable region 160C. The firststable region 160A, the second stable region 160B, and the third stableregion 160C can be adjacent to the first boundary 122A, the secondboundary 122B, and the third boundary 122C, respectively. It should benoted that, since there are a plurality of conductive lines (not shown)disposed across the substrate border 123 for electrically connecting thedisplay region 104 to a driving element (such as an integrated circuit,not shown), the stable cutting region 160 is not disposed on the secondsubstrate 103 along the substrate border 123. Namely, the stable cuttingregion 160 is not adjacent to the substrate border 123. In addition, thestable cutting region 160 is not in contact with four corners of thesecond substrate 103. Furthermore, any two of the first stable region160A, the second stable region 160B, and the third stable region 160C donot contact each other, and alignment marks (not shown) for cutting canbe disposed on the four angles of the second substrate 103. The spacers161 can be made of a photoresist material, such as a positivephotoresist material or a negative photoresist material. In oneembodiment, the spacers can be formed by subjecting a photoresist layerto a patterning process. The patterning process can include thefollowing steps: coating a photoresist layer, soft-baking, aligningmask, exposing, post-exposure baking, developing, and hard-baking.

According to an embodiment of the disclosure, the stable cutting regionhas a width between about 50 μm and 150 μm. The percentage ratio of thewidth W0′ of the stable cutting region to the width W11 of the sealantcan be between 6% and 50% (i.e. 6%≦W0′/W11≦50%). As shown in FIG. 28,the part of the stable cutting region 160, which is not occupied by thespacer 161, can be filled with the sealant 120.

FIG. 29 is a schematic drawing of the display device of FIG. 28 in the Xdirection. According to embodiments of the disclosure, after cutting,the side walls of the first substrate 101 can have a first cutting cracksurface 156, a first median crack surface 157, and a first pressurecrack surface 158, wherein the first median crack surface 157 isdisposed between the first cutting crack surface 156 and the firstpressure crack surface 158. The first cutting crack surface 156 is acrack section formed by a cutter wheel and the first cutting cracksurface 156 is disposed at a side of the first substrate far away fromthe sealant 120. The first median crack surface 157 is an extendingsection due to pressure from the cutter wheel. The first pressure cracksurface 158 is a peeling section formed by external pressure during apeeling process. In an embodiment of the disclosure, if the side wall154 has a relatively larger first median crack surface 157, the sidewall 154 would merely have the first cutting crack surface 156 and thefirst median crack surface 157, and thus there is no first pressurecrack surface 158 formed on the side wall 154. In particular, theroughness of the first cutting crack surface 156, the first median cracksurface 157, and the first pressure crack surface 158 are different.

On the other hand, side walls 164 of the second substrate 103 can have asecond cutting crack surface 166, a second median crack surface 167, anda second pressure crack surface 168, wherein the second median cracksurface 167 is disposed between the second cutting crack surface 166 andthe second pressure crack surface 168. The second cutting crack surface166 is a crack section formed by a cutter wheel and the second cuttingcrack surface 166 is disposed at a side of the second substrate 103 faraway from the sealant 120. The second median crack surface 167 is anextending section due to pressure from the cutter wheel. The secondpressure crack surface 168 is a peeling section formed by externalpressure during a peeling process. In an embodiment of the disclosure,if the side wall 154 has a relatively larger second median crack surface167, the side wall 164 would merely have the second cutting cracksurface 166 and the second median crack surface 167, and thus there isno second pressure crack surface 168 formed on the side wall 164. Inparticular, the roughness of the second cutting crack surface 166, thesecond median crack surface 167, and the second pressure crack surface168 are different.

As shown in FIG. 30A, since the display device of the disclosure 100 hasa stable cutting region 160 in order to increase support function duringcutting process, the ratio of the sum of the thickness T11 of the firstcutting crack surface 156 and the thickness T12 of the first mediancrack surface 157 to the thickness T01 of the side wall 154 of the firstsubstrate 101 is from 0.3 to 1 (i.e. 0.3 (T11+T12)/T01≦1), such as from0.5 to 1, or from 0.7 to 1. Furthermore, the ratio of the sum of thethickness T21 of the second cutting crack surface 166 and the thicknessT22 of the second median crack surface 167 to the thickness T02 of theside wall 164 of the second substrate 103 is from 0.3 to 1 (i.e.0.3≦(T21+T22)/T02≦1), such as from 0.5 to 1, or from 0.7 to 1. As aresult, the cutting and breaking performance of the display device canbe improved, the substrate breakage rate can be reduced, and the yieldof the display device can be increased. In addition, the first pressurecrack surface 158 can have a thickness T13, and the second pressurecrack surface 168 can have a thickness T23.

FIG. 30A is cross-sectional view of the display devices of FIG. 28 alongline E-E′. The first cutting crack surface 156 and the first mediancrack surface 157 define a first angle θ1, wherein the first angle θ1can be greater than 90 degrees and less than 270 degrees; the secondcutting crack surface 166 and the second median crack surface 167 definea second angle θ2, wherein the second angle θ2 can be greater than 90degrees and less than 270 degrees; the first median crack surface 157and the first pressure crack surface 158 define a third angle θ3,wherein the third angle θ3 can be greater than 90 degrees and less than270 degrees; and, the second median crack surface 167 and the secondpressure crack surface 168 define a fourth angle θ4, wherein the fourthangle θ4 can be greater than 90 degrees and less than 270 degrees.

As shown in FIG. 30A, a person skilled in the art would know that thefirst substrate 101 and the second substrate 103 can optionally haveother elements, and a display medium layer 215, ex. a liquid-crystallayer, can be disposed between the first substrate 101 and the secondsubstrate 103. For example, the first substrate 101 can be an arraysubstrate, and the second substrate 103 can be a color filter substrate.In the stable cutting region 160 (such as the third stable region 160C),there is a distance D9 between at least one of the spacers 161 and theside wall 164 of the second substrate 103. Namely, the distance D9 isthe minimum distance between the side wall 164 of the second substrate103 and the spacers 161. The distance D9 is from 0 to 200 μm. There is adistance D10 between at least one of the spacers 161 and the side wall154 of the first substrate 101. Namely, the distance D10 is the minimumdistance between the side wall 154 of the first substrate 101 and thespacers 161. In particular, the distance D10 is greater than thedistance D9.

As shown in FIGS. 28 and 30A, the ratio between the area occupied by thespacers 161 and the stable cutting region is from 1% to 5%. Herein, thearea occupied by the spacers 161 is the sum of a top surface area A1 ofall the spacers 161. In an embodiment of the disclosure, the top surfaceof the spacer 161 is closer to the first substrate 101, in comparisonwith the second substrate 103. As shown in FIG. 30B, according to otherembodiments of the disclosure, the spacer 161 can be disposed on thefirst substrate 101 (i.e. the top surface of the spacer 161 is closer tothe second substrate 103, in comparison with the first substrate 101).According to embodiments of the disclosure, the plurality of spacers 161can have the same or different top surface area A1. In addition,according to some embodiments of the disclosure, the spacer 161 withinthe stable cutting region 160 can be disposed across the predeterminedcutting line resulting in remaining a part of the spacer 161 aftercutting, as shown in FIG. 30C. According to other embodiments of thedisclosure, the spacer 161 can be not overlapped by the sealant 120, asshown in FIG. 30D.

As shown in FIG. 31, according to another embodiment of the disclosure,a planarization layer 162 can be disposed on the first substrate 101 andwithin the stable cutting region 160. The part of the stable cuttingregion 160, which is not occupied by the spacer 161 and theplanarization layer 162, can be filled with the sealant 120. Theplurality of spacers 161 can be disposed between the planarization layer162 and the second substrate 103. According to some embodiments of thedisclosure, the planarization layer 162 can be a patterned layer or havetrenches. At least part of the sealant 120 is separated from the firstsubstrate 101 by the planarization layer 162 (the planarization layer162 is disposed between the first substrate 101 and the sealant 120),and at least part of the second substrate 103 is separated from theplanarization layer 162 by the spacers 161 (the spacers 161 are disposedbetween the second substrate 103 and the planarization layer 162). Theplanarization layer 162 can be a layer with insulating properties, suchas a dielectric material, or photosensitive resin.

FIG. 32 is a top-view of a display device main substrate according to anembodiment of the disclosure, wherein the display device 100 of FIG. 28can be obtained by cutting the display device main substrate of FIG. 32.The cutting process can be, for example, a single-tool cutting process,a multi-tool cutting process, or a laser cutting process.

As shown in FIG. 32, the stable cutting region 160 (including the firststable region 160A, the second stable region 160B, and the third stableregion 160C) of the display device main substrate 201 is disposed alonga predetermined cutting line 124A of the first substrate and apredetermined cutting line 124B of the second substrate. In anembodiment of the disclosure, the predetermined cutting line 124B of thesecond substrate constitutes a symmetrical axis for the stable cuttingregion 160 respectively. Namely, two parts of the stable cutting region160 separated by the predetermined cutting line 124B of the secondsubstrate have the same area and are substantially symmetrical.According to other embodiments of the disclosure, the predeterminedcutting line 124B of the second substrate can constitute anon-symmetrical axis for the stable cutting region 160.

According to embodiments of the disclosure, the surface of the spacer161 within the stable cutting region 160 in contact with the firstsubstrate 101 (or the second substrate 103) can be circular, elliptical,square, rectangular, or a combination thereof. FIGS. 33A to 33F areclose-up diagrams of the second stable region 160B of the display devicemain substrate of FIG. 32.

As shown in FIG. 33A, the plurality of spacers 161 can be disposed withthe stable cutting region and set in parallel as an aligned array. Inaddition, the plurality of spacers 161 can be set in a staggered array,as shown in FIG. 33B. According to another embodiment of the disclosure,the predetermined cutting line 124B of the second substrate can passthrough the spacers 161, as shown in FIG. 33C. Moreover, as shown inFIG. 33A, the width W0 between one side of the stable cutting region 160(such as the second stable region 160B) and the predetermined cuttingline 124B, and the width W0′ between the opposite side of the stablecutting region 160 (such as the second stable region 160B) and thepredetermined cutting line 124B are each from 50 μm to 150 μm.

In addition, the surface of the spacer 161 within the stable cuttingregion 160 in contact with the first substrate 101 (or the secondsubstrate 103) can be a rectangle and have a short edge 163 and a longedge 165. The long edge 165 can be substantially perpendicular to thepredetermined cutting line 124B of the second substrate (as shown inFIG. 33D). On the other hand, the long edge 165 can also be parallel tothe predetermined cutting line 124B of the second substrate (as shown inFIG. 33E). According to other embodiments of the disclosure, the spacers161 can be substantially symmetrically disposed within the stablecutting region 160 with reference to the predetermined cutting line 124Bof the second substrate. Furthermore, the spacers 161 can benon-symmetrically disposed with the stable cutting region 160, as shownin FIG. 33F. According to other embodiments of the disclosure, the firstsubstrate 101 and the second substrate 103 may be not a rectangle, andthe predetermined cutting lines can be modified according to thesubstrate and not limited to being parallel to or perpendicular to eachother.

As shown in FIG. 34, according to an embodiment of the disclosure, inorder to narrow the frame of the display device, in addition to thewidths of the non-display regions adjacent to the first boundary 122Aand the third boundary 122C, the widths of the non-display regionsadjacent to the second boundary 122B are also required to be reduced.Therefore, the sealant is closer to the display region. In order toprevent the sealant 120 from coming into contact with the display region104 near the corner defined by the second boundary 122B and the thirdboundary 122C, the sealant 120 can be designed to consist of a linearportion 120A and an U-shaped portion 120B. The linear portion 120A isadjacent to the second boundary 122B, and the U-shaped portion 120B isadjacent to the first boundary 122A, the substrate border 123, and thethird boundary 122C. Therefore, the distance D12 between the sealant 120near the corner, which is defined by the second boundary 122B and thethird boundary 122C, and the display region 104 is greater than thedistance D11 between the sealant 120 adjacent to the second boundary122B and the display region 104. Namely, the distance D11 is the minimumdistance between the linear portion 120A and the display region 104, andthe distance D12 is the minimum distance between the sealant border 127(of the linear portion 120A and the U-shaped portion 120B) and thedisplay region 104. In particular, the distance D12 is greater than orequal to the distance D11.

On the other hand, the display device of the disclosure can furtherinclude a test circuit disposed outside the display region. as shown inFIG. 35, the display device 100 can include a first contacting pad 172and a second contacting pad 174 disposed on the first substrate 101 andoutside the display region 104. According to another embodiment, thedisplay device 100 can further include a test circuit 170 substantiallydisposed along a part of edges of the first substrate, and the part ofthe edges of the first substrate substantially coincided with a part ofedges of the second substrate. In the embodiment, the part of the edgesof the first substrate comprises three edges which are the firstboundary 122A, the second boundary 122B, and the third boundary 122C.The first contacting pad 172 electrically connects to the secondcontacting pad 174 via the test circuit 170. As shown in FIG. 35, thetest circuit 170 is not disposed along the substrate border 123. As aresult, after the cutting process for fabricating the display device100, the voltage, resistance, or pulse waveform data between the firstcontacting pad 172 and the second contacting pad 174 can be measured andcompared with a reference voltage, resistance, or pulse waveform data,in order to detect whether cutting shift is occurring on the displaydevice.

For example, when cutting shift occurs during the cutting of the displaydevice main substrate, the testing circuit can be damaged by the cuttingprocess, since the test circuit is disposed along the three edges of thefirst substrate, and the three edges of the first substrate aresubstantially coincided with the three edges of the second substrate(i.e. the test circuit is disposed between the display region and thepredetermined cutting line). Therefore, the resistance between the firstcontacting pad 172 and the second contacting pad 174 would be increasedwhen the testing circuit is damaged in comparison with a referenceresistance, and thus a cutting shift of the display device is detected.

Suitable materials for the test circuit 170, the first contacting pad172, and the second contacting pad 174 include a single layer ormultiple layers, and made of metal conductive material (such as aluminum(Al), copper (Cu), molybdenum (Mo), titanium (Ti), platinum (Pt),iridium (Ir), nickel (Ni), chromium (Cr), silver (Ag), gold (Au),tungsten (W), or an alloy thereof), metallic compound conductivematerial (such as: aluminum-containing compound, copper-containingcompound, molybdenum-containing compound, titanium-containing compound,platinum-containing compound, iridium-containing compound,nickel-containing compound, chromium-containing compound,silver-containing compound, gold-containing compound,tungsten-containing compound, magnesium-containing compound, or acombination thereof), or a combination thereof. The material of the testcircuit 170 and the material of the first contacting pad 172 (or thesecond contacting pad 174) can be the same or different. In addition, apassivation layer (not shown) can be formed on the test circuit 170, inorder to prevent the test circuit 170 from coming into contact with andbeing deteriorated by the sealant 120. The passivation layer can beorganic insulating materials (such as photosensitive resins) orinorganic insulating materials (such as silicon nitride, silicon oxide,silicon oxynitride, silicon carbide, aluminum oxide, or a combinationthereof). as shown in FIG. 36, according to another embodiment of thedisclosure, a circuit board 180 having a first circuit 176 and a secondcircuit 178 can be provided. Since the first circuit 176 and the secondcircuit 178 electrically connect to the first contacting pad 172 and thesecond contacting pad 174, respectively, a testing signal can beprovided to the test circuit 170 via the first contacting pad 172 andthe second contacting pad 174 in order to detect whether cutting shiftis occurring on the display device. The circuit board 180 can be aflexible substrate, a rigid substrate, or a metal core PCB.

In addition, as shown in FIG. 37, according to other embodiments of thedisclosure, a driving unit 106 can be disposed on the first substrate101 outside the display region 104. Since the driving unit 106 canelectrically connect to the first contacting pad 172 and the secondcontacting pad 174 via the first circuit 176 and the second circuit 178,a testing signal provided by the driving unit 106 can be provided to thetest circuit 170 via the first contacting pad 172 and the secondcontacting pad 174 in order to detect whether cutting shift is occurringon the display device. It should be noted that the testing signal can bea common electrode voltage signal, or a ground voltage signal. Thedriving unit 106 can electrically connect to the display region 104 viaa plurality of signal lines (not shown) to provide signals to theplurality of pixels (not shown) for displaying images. The driving unit106 can be an integrated circuit (IC).

According to embodiments of the disclosure, the display device hasspacers disposed on the stable cutting region in order to increase thestructural stability during a cutting process, improve the cutting andbreaking performance, and reduce the substrate breakage rate. As aresult, the yield of the display device can be improved. In addition,according to embodiments of the disclosure, the display device of thedisclosure includes a test circuit disposed along predetermined cuttinglines. Therefore, after the cutting process, the test circuit can beused to detect whether cutting shift is occurring on the display device.

Although some embodiments of the present disclosure and their advantageshave been described in detail, it should be understood that variouschanges, substitutions and alterations can be made herein withoutdeparting from the spirit and scope of the disclosure as defined by theappended claims. For example, it will be readily understood by thoseskilled in the art that many of the features, functions, processes, andmaterials described herein may be varied while remaining within thescope of the present disclosure. Moreover, the scope of the presentapplication is not intended to be limited to the particular embodimentsof the process, machine, manufacture, composition of matter, means,methods and steps described in the specification. As one of ordinaryskill in the art will readily appreciate from the disclosure of thepresent disclosure, processes, machines, manufacture, compositions ofmatter, means, methods, or steps, presently existing or later to bedeveloped, that perform substantially the same function or achievesubstantially the same result as the corresponding embodiments describedherein may be utilized according to the present disclosure. Accordingly,the appended claims are intended to include within their scope suchprocesses, machines, manufacture, compositions of matter, means,methods, or steps.

What is claimed is:
 1. A display device, comprising: a first substrate;a light shielding layer disposed on the first substrate, comprising: afirst matrix portion, having a first side and a second side respectivelylocated at two opposite sides of the first matrix portion; a secondmatrix portion intersecting with the first matrix portion to form anintersection; and an enlarged portion disposed corresponding to theintersection, wherein the enlarged portion has a first region, a secondregion, a third region, and a fourth region, wherein the first regionand the third region locate at the first side, the second region and thefourth region locate at the second side, the first region has a firstcurved edge, and the second region has a second curved edge; and aspacer located corresponding to the intersection, wherein a firstdistance is a distance between the spacer and the first curved edge, anda second distance is a distance between the spacer and the second curvededge, wherein the first distance is different from the second distance.2. The display device as claimed in claim 1, wherein a first surface ofthe spacer is adjacent to the light shielding layer, a first tangentline is a tangent line of the first curved edge of the first region, asecond tangent line is a tangent line of the first surface of thespacer, the first tangent line is parallel to the second tangent line,the second tangent line is adjacent to the first curved edge of thefirst region, and the first distance is a distance between the firsttangent line and the second tangent line, a third tangent line is atangent line of the second curved edge of the second region, a fourthtangent line is a tangent line, the fourth tangent line is adjacent tothe second curved edge of the second region, and the second distance isa distance between the third tangent line and the fourth tangent line.3. The display device as claimed in claim 2, wherein the third tangentline is parallel to the first tangent line, and the second tangent lineis parallel to the fourth tangent line, a third distance is a distancebetween the first tangent line and the third tangent line, a fourthdistance is a distance between the second tangent line and the fourthtangent line, and the third distance is greater than the fourthdistance.
 4. The display device as claimed in claim 1, wherein the firstdistance is less than the second distance.
 5. The display device asclaimed in claim 1, further comprising a second substrate locatedopposite to the first substrate, wherein the spacer is located betweenthe first substrate and the second substrate.
 6. The display device asclaimed in claim 1, wherein a first segment of the second matrix portionis located at the first side, a second segment of the second matrixportion is located at the second side, the first segment extends along afirst inclined direction, the second segment extends along a secondinclined direction, the first inclined direction is different from thesecond inclined direction.
 7. The display device as claimed in claim 1,wherein the first region is corresponding to a first color filter layer,and the second region is corresponding to a second color filter layer.8. The display device as claimed in claim 7, wherein a color of thefirst color filter layer is different from a color of the second colorfilter layer.
 9. The display device as claimed in claim 7, wherein acolor of the first color filter layer is the same with a color of thesecond color filter layer.
 10. The display device as claimed in claim 1,wherein the first region is corresponding to a first sub-pixel, thesecond region is corresponding to a second sub-pixel, the third regionis corresponding to a third sub-pixel, and the fourth region iscorresponding to a fourth sub-pixel.
 11. The display device as claimedin claim 1, wherein a range of the first distance is between 5 μm to 10μm, and a range of the second distance is between 5 μm to 10 μm.
 12. Anelement substrate, comprising: a first substrate; a light shieldinglayer disposed on the first substrate, comprising: a first matrixportion, having a first side and a second side respectively located attwo opposite sides of the first matrix portion; a second matrix portionintersecting with the first matrix portion to form an intersection; andan enlarged portion disposed corresponding to the intersection, whereinthe enlarged portion has a first region, a second region, a thirdregion, and a fourth region, wherein the first region and the thirdregion locate at the first side, the second region and the fourth regionlocate at the second side, the first region has a first curved edge, andthe second region has a second curved edge; and a spacer locatedcorresponding to the intersection, wherein a first distance is adistance between the spacer and the first curved edge, and a seconddistance is a distance between the spacer and the second curved edge,wherein the first distance is different from the second distance. 13.The element substrate as claimed in claim 12, wherein a first surface ofthe spacer is adjacent to the light shielding layer, a first tangentline is a tangent line of the first curved edge of the first region, asecond tangent line is a tangent line of the first surface of thespacer, the first tangent line is parallel to the second tangent line,the second tangent line is adjacent to the first curved edge of thefirst region, and the first distance is a distance between the firsttangent line and the second tangent line, a third tangent line is atangent line of the second curved edge of the second region, a fourthtangent line is a tangent line of the first surface of the spacer, thethird tangent line is parallel to the fourth tangent line, the fourthtangent line is adjacent to the second curved edge of the second region,and the second distance is a distance between the third tangent line andthe fourth tangent line.
 14. The element substrate as claimed in claim13, wherein the third tangent line is parallel to the first tangentline, and the second tangent line is parallel to the fourth tangentline, a third distance is a distance between the first tangent line andthe third tangent line, a fourth distance is a distance between thesecond tangent line and the fourth tangent line, and the third distanceis greater than the fourth distance.
 15. The display device as claimedin claim 12, wherein the first distance is less than the seconddistance.
 16. The element substrate as claimed in claim 12, wherein afirst segment of the second matrix portion is located at the first side,a second segment of the second matrix portion is located at the secondside, the first segment extends along a first inclined direction, thesecond segment extends along a second inclined direction, the firstinclined direction is different from the second inclined direction. 17.The element substrate as claimed in claim 12, wherein the first regionis corresponding to a first sub-pixel, the second region iscorresponding to a second sub-pixel, the third region is correspondingto a third sub-pixel, and the fourth region is corresponding to a fourthsub-pixel.
 18. The element substrate as claimed in claim 12, wherein arange of the first distance is between 5 μm to 10 μm, and a range of thesecond distance is between 5 μm to 10 μm.